金属表面処理剤
金属表面処理剤
技術と知識から繰り出す、高品質が叶える確かな仕上がり。 金属表面を高精度に仕上げるために用いる油、汚れや酸化物などを除去する前処理剤はプリント基板用/高速めっき用、アルカリ性/酸性/中性、 シャワー用/浸漬用/電解用など用途によって多様な製品をラインナップする他、外観/硬度/応力調整などの特性を付与する各種めっき用添加剤、pH 調整剤、後処理剤など、 めっきを含む金属表面処理をするために必要なあらゆる薬剤の開発・販売を行っています。
1～29 item / All 29 items
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Immersion and cathodic electrolysis degreasing surfactant RCS-23
It is a surfactant for immersion and cathodic electro-degreasing of reels.
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Soft etching agent "MEOX"
Maintain a stable etching speed! Oxides are less likely to form, resulting in a clean metal surface.
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Glossy nickel plating additive 'NA-100-J/NA-2(×2)'
Analysis management is possible! Finishing plating such as chrome and gold can be done directly.
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Immersion and cathodic electrolysis surfactant 'RCS-25'
Due to its neutrality, it is possible to create a wide range of degreasing solutions from alkaline to neutral areas, depending on the presence or absence of builder additives!
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Defoaming/Defoaming auxiliary surfactant 'MGC-25'
By being able to replenish surfactants that are consumed through emulsification and extraction on their own, the frequency of updates can be reduced!
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Glossy nickel plating additive 'NA-1000/2000'
You can achieve a beautiful glossy nickel plating with the same work as before and a reduced amount of additives!
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Semi-gloss nickel plating additive "M-801/802"
No activated carbon treatment is necessary to remove decomposition products, as no harmful decomposition products are generated!
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Copper discoloration prevention agent "CAT"
By creating a semipermeable monomolecular chemical bonding barrier on the copper surface, oxidation, discoloration, and corrosion are prevented!
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Copper discoloration prevention agent "Evershine Cu"
Just by soaking, it forms an oxidation prevention film! It does not cause any obstacles to soldering.
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Liquid acid "SAS" for various metal surface treatments.
Simply by soaking, it removes rust from steel, scale from heat treatment, oxide films, and brazing flux!
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Black nickel plating "BKN method"
Can be used with equipment similar to that for regular glossy plating! A uniform black coating can be obtained over a wide range of concentrations.
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Non-electrolytic nickel blackening process "CMN process"
The minimum required film thickness of non-electrolytic Ni(CMN-N) is very thin at about 2μm, which has little impact on dimensional accuracy!
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Acid Cleaner for Printed Circuit Boards 'PAC-200'
It has good foam stability and excellent rinsability! It is highly effective in degreasing fingerprints and other residues.
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Neutral cleaner for printed circuit boards "PAC-310X"
Not only cleaning the copper surface but also enhancing the wettability effect at the resist interface, compatible with high-density substrates!
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Immersion and cathodic electrolysis degreasing surfactant 'RCS-21/21G'
Environmentally friendly products! Suitable for degreasing applications in reel-to-reel plating.
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Technical Data: SN-CSB
In nickel sulfamate, the SN-CSB bath can achieve mechanical properties almost identical to those of the boric acid bath.
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Shower Printed Circuit Board Acid Cleaner 'PAC-150'
Does not contain substances covered by the RoHS directive! Cleaning and activation of the copper surface can be performed simultaneously.
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Defoaming/Defoaming auxiliary surfactant 'MGC-18'
By being able to replenish the surfactant that is consumed through emulsification and extraction on its own, the frequency of updates can be reduced!
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Non-cyanide nickel plating stripping method "Best Rip NF/B"
Infrequent updates and reduced waste liquid costs! Fast stripping speed and operable at low temperatures.
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Copper pyrophosphate plating additive "CP-25"
The plating solution is weakly alkaline and is a bivalent copper solution consisting of copper and potassium pyrophosphate!
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Heat-resistant non-magnetic nickel plating 'GN-310'
New characteristics not obtained with conventional electroless nickel plating.
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New satin plating process "KASUMI"
There is no need for regular liquid updates, and management is easy, making it very cost-effective!
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Nickel plating related chemicals for sulfamic acid
To accommodate various plating properties such as hardness, flexibility, and internal stress, we offer a range of additives for the sulfamic acid nickel bath!
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Coarse Nickel Plating Agent 'RFN-200' High Roughness Type
The surface of the precipitate is active and can be applied as various plating substrates!
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General-purpose roughening nickel plating agent "RFN-500"
No special pre-process or post-process is needed! It can be easily switched from the current nickel plating bath.
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Pit prevention agent for various plating solutions 'NP-A'
It is suitable as a pit prevention agent for various plating solutions that require low foaming and air agitation!
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Nickel Sulfamate Concentrate Solution "SN Conc 185" - 65% High Concentration Product
Ideal for building and replenishing sulfamic acid nickel plating solution.
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High corrosion-resistant sulfamic acid nickel plating additive 'SN-20'
Free of sulfur, it excels in high corrosion resistance, heat discoloration resistance, and low contact resistance.
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Additive for nickel plating with sulfamic acid 'SN-100-J'
Many successful applications in electronic components! This is an easy-to-use additive with balanced physical properties (hardness, flexibility, stress, gloss).
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