ナラサキ産業 メカトロソリューション部　機能材料課 Official site

Laser Processing Examples 3. Hole Processing in Ceramics *Photos are also included in the PDF catalog. Please download and check. [Example] Material: Alumina Hole Diameter: 50μ Pitch: 0.25mm Using a 400W fiber laser from Furukawa Electric, hole processing has been performed on 0.65T alumina.

Our company specializes in laser contract processing and laser unit sales. 【Laser Contract Processing】 Laser Types: Femtosecond, Picosecond, UV, Fiber, CO2 Output: Prepared according to the material and processing requirements. Please inquire. Processing Details: Holes, grooves, welding, etc. Materials: No restrictions. We can also prepare test materials in-house. Cost: Negotiable. 【Laser Units】 We provide laser units that directly meet customer needs, eliminating unnecessary features, from tabletop systems to mass production systems. Depending on the processing requirements, selection from emitters is possible. 【XY Drive Stage】 Capable of mounting drive stages with repeatability precision at the nanometer level. By combining stages suitable for ultra-high precision processing with laser oscillators, we realize laser processing machines that can be used for mass production.

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