Wafer downsizing is possible, water jet laser processing.
It is possible to downsize various wafers using water jet laser processing, which excels at machining difficult materials like SiC with minimal heat impact.
Using a water jet laser, it is possible to downsize a 12-inch silicon wafer to 8 inches. We offer contract processing for various wafers including silicon, SiC, patterned wafers, and GaN. Additional processing with a water jet laser results in minimal thermal impact, ensuring damage-free outcomes without chipping on either side. It is also possible to add notches and orifices in compliance with SEMI standards. Even for SiC, which is typically considered a difficult material to machine, the high absorption rate of the laser allows for additional processing that is not achievable with conventional machining. Please feel free to contact us for more information.
basic information
Wafer downsizing - Silicon - SiC - Pattern wafer - Various wafers such as GaN We accept processing from one piece. Please understand that the delivery time for additional processing may be affected by the availability of processing machines.
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Applications/Examples of results
・Device manufacturers ・Semiconductor manufacturing equipment manufacturers ・Research institutions ・Other prototype development related
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Narasaki Sangyo Co., Ltd. "Functional Materials Division" specializes in high-performance material contract processing. The materials we handle fall into "five categories": 1. Ceramics/Glass 2. Metals 3. Engineering Plastics 4. Carbon 5. Surface Treatment We offer a wide range of services, and if you provide us with a single production drawing, we can deliver various materials and surface treatments as a one-stop solution. We cater to everything from general-purpose to specialty materials, including high-precision, fine, electrical discharge, laser processing, as well as surface treatments such as coating, precision cleaning, and blasting. Our particular strength lies in high-precision and short-lead-time processing of ceramics. By machining from pre-fired materials, we achieve short lead times for ceramics that traditionally take several months. We handle a wide range of ceramics, including machinable ceramics like Hotovel, as well as fine ceramics such as alumina and zirconia, and non-oxide ceramics like silicon carbide, silicon nitride, and aluminum nitride. We are also actively engaged in proposing cost reductions for overseas ceramics and other international materials. We can accommodate various contract processing projects, from prototype development starting with a quantity of one to mass production.