Achieving high-precision machining of difficult-to-cut materials! Introduction to Laser Microjet.
The processing technology "microjet laser," which guides lasers using water jets the thickness of a hair, enables the machining of difficult-to-cut materials.
In mechanical processing, it is extremely difficult to pursue tact time and improve processing quality. The technology that solves such concerns is "Laser Microjet." Laser Microjet = Water Laser Processing is a method that guides a laser to the material using a water jet as thin as a human hair. 【Processing Target Materials】 - Ceramics (alumina, aluminum nitride, silicon carbide, etc.) - Silicon - Metals (copper, aluminum, stainless steel, alloys, etc.) - Diamond, etc. 【Processing Content】 - Holes - Grooves - Cutouts - Shape processing, etc. By utilizing the total reflection phenomenon at the interface of the layered water jet, the laser beam is irradiated onto the material. Since the water jet continuously strikes the target workpiece, the thermal effects of the laser are minimized to the extreme, preventing phenomena such as burn marks due to material melting and resulting in a high-quality processed surface finish. This innovative processing technology achieves high precision and high aspect ratio cutting, hole, and groove processing of materials such as metals and ceramics. *Laser Microjet is a trademark of the processing technology developed by SYNOVA. Please feel free to contact us.
basic information
1. Contract Processing If you provide us with processing drawings, conceptual drawings, etc., we can accommodate contract processing. - Additional processing with supplied materials - Shape processing such as wafer downsizing - Test processing for verifying processing results Please feel free to let us know your requests. *We can also prepare processing materials for you.* 2. Laser Processing Machine Sales We also sell processing equipment. *For more details, please refer to the catalog.*
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Applications/Examples of results
- Ceramics For example, ultra-hard materials that are difficult to machine, such as SiC, can be processed into shapes using laser microjet technology. - Silicon Downsizing from 12-inch wafers to 8-inch wafers is possible, and notches and orifices can be processed according to customer specifications. - Metal Processing High-quality finished surfaces can be achieved regardless of material type. This includes improving the quality of machined surfaces, processing complex shapes, and drilling operations.
