"Water laser" that achieves high aspect ratio processing for SiC (silicon carbide).
The laser microjet, which irradiates a laser inside a water jet, makes it easier to process ultra-hard materials like SiC that are difficult to machine.
Even for sintered SiC (silicon carbide), which is very difficult to machine, it becomes easy to process holes and grooves using laser microjet technology. In machining processes such as drilling, grooving, and hollowing, which are impossible or would require an enormous amount of time, this laser microjet—water laser processing method allows for machining in less than half the usual time. By utilizing the total reflection phenomenon at the interface of the layered water jet, the laser beam is irradiated onto the material. Since the water jet continuously impacts the target workpiece, it minimizes the thermal effects of the laser to the extreme, preventing phenomena such as melting and warping, resulting in a high-quality finished surface. This innovative processing technology achieves high-precision and high-aspect-ratio cutting, drilling, and grooving of materials such as metals and ceramics. *Laser microjet is a trademark of the processing technology developed by SYNOVA.
basic information
Our company specializes in contract processing of high-performance materials, including ceramics, and provides finished products. We can accept contract processing from a single piece, but please understand that the production lead time for laser processing may be affected by the availability of processing machines.
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Applications/Examples of results
It is widely used in various fields, including semiconductors, aircraft, automobiles, diamond applications (tools, jewelry), and electronic components.
