ナラサキ産業 メカトロソリューション部　機能材料課 Official site

Various setters for firing such as MLCC and ferrite components, plasma-resistant materials for semiconductor manufacturing equipment, crucibles for various metal melting, transport rollers, and various quartz components. We have developed a dip coating technique for ceramics that was generally considered difficult, enabling thick film coatings on various fine ceramics, quartz, isotropic graphite, and refractory materials that are hydrophobic. Features: 1. Unique dipping technology provides: - High freedom of shape, strong adhesion to substrates, uniform film thickness, and high surface roughness. - While the design freedom for the coated object increases, consultation is required based on the shape. 2. Wide range of coating materials and target substrates: - Coatable ceramic materials: Most oxides and non-oxides (BN, SiC, Si3N4, etc.) - Target substrates: General fine ceramics, isotropic graphite, glass such as quartz, refractories, and metals (heat resistance temperature confirmation required). 3. High advantages of dipping over other coating methods: - Low cost (mass production effect) - Capable of handling three-dimensional structures, hollow shapes, and large sizes (size confirmation required). Film Thickness: Standard target film thickness: 50μ±5–10μ We optimize the use of composite ceramic films according to applications. Please feel free to contact us.

We can respond after discussions based on a trial production of one piece. 1. Specify the product drawings and the type of ceramics to be coated. 2. For the product drawings, only the substrate is specified, and the ceramics to be coated will be discussed according to the desired performance. 3. Verify from scratch, including the substrate and coating types, based on the current theme. 4. Discuss coatings for complex shapes that are difficult with conventional methods. The unique dipping technology allows for high freedom of shape and adhesion, enabling discussions on various themes beyond thick films. In particular, with SDGs and carbon neutrality as paramount issues, improving the product lifecycle is an urgent theme. By effectively utilizing the dipping technology we are developing, we can greatly expect to extend the lifespan of components.

【Achievements / Development Targets】 - Components for semiconductor manufacturing equipment: enhanced durability against plasma and corrosion - Setter for MLCC firing: improved setter longevity and compatibility - Setter for ferrite components: improved setter longevity, warping prevention, and compatibility - Various other setters - Coating for isotropic graphite - Coating for the inner surface of crucibles for metal melting: improved wettability, longevity, and prevention of impurity leakage - Transport components for inner furnaces of metal press machines, etc. For more details, please feel free to contact us.