Long-lasting without peeling! Ceramic coating for electronic component setters.
[New Technology] Ceramic coating is possible up to the end face with a new method different from thermal spraying! *Available in a range from standard grade to dense grade!
In electronic components, it can be said that there is almost always a "sintering" process involved. Therefore, we would like to introduce a ceramic coating method using a dipping technique that differs from conventional thermal spraying for the setters you are using. 【Four Features】 ◆ High degree of freedom in shape, allowing ceramic coating on 3D shapes at meter scale ◆ Ceramic coating possible on most high-performance materials ◆ Ceramic coating possible with an average thickness of 50μm ◆ Coating surface has good roughness and excellent smoothness (Ra 0.8 or lower) 【Materials that can be coated】 *Main setter materials ■ Mullite ■ Alumina-based ■ Zirconia-based ■ SiC-based *We can accommodate both porous and dense ceramics. *Ceramic coating is also possible on other materials. Currently, we have a lineup of various dense grades of ceramic coating films (some are still in development), and by downloading, you can view SEM image data categorized by grade. We can handle a wide variety of film types, so please feel free to contact us.
basic information
(We have listed frequently asked questions) Q: Regarding the quantity of support A: We can accommodate from prototype to mass production. Q: I don't know how to select the type of film A: We will propose the optimal ceramic coating film based on the electronic components in question and the setter material. Q: What if I want to develop an original ceramic coating recipe? A: We can accommodate that. Q: Is it possible to request procurement of the setter's base material? A: It is possible, but it may be cheaper if provided by the customer. ■ Please feel free to ask any other questions. (Thin Film Formation Method) 1. Generate the ceramic slurry you want to coat. 2. Dip the workpiece into the tank containing the slurry. 3. Dry and bake to cure. Since baking is required, the heat resistance of the base material is also a key point. * In some cases, baking may not be necessary depending on the usage environment. With our unique dipping technology, we offer high adhesion with a high degree of freedom in shape, allowing discussions on various themes beyond thick films. ■ We also have sample products and various data available. We are always ready to accommodate meetings in person or via web meetings, so please feel free to reach out to us first.
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Narasaki Industries provides a one-stop service from material selection to completion and processed products. We are currently offering a comprehensive catalog of high-performance materials. For more details, please download the PDF and take a look.
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