Special laser processing of ceramic substrates has minimal thermal impact and is less prone to oxidation.
*We are currently offering a free collection of water laser processing case studies! It also includes other types of processing besides ceramic substrate machining.*
Laser processing of ceramic substrates has faced the challenge of oxidation due to thermal effects. In response to such challenges, we propose a processing technology that is less prone to oxidation through "water laser processing," which minimizes thermal effects. This is a must-see for those struggling with the processing of ceramic substrates required for high-frequency components or heat resistance!
basic information
**Features and Characteristics** 〇 Features - Processed with a 532nm wavelength green laser. - Particularly compatible with ceramics, achieving high aspect ratios during hole processing. - Capable of processing various ceramics and other metals. *Note: Glass, resin, wood, etc. cannot be processed. 〇 Characteristics - Achieves cleaner hole processing with less thermal impact compared to conventional laser processing. - Minimal energy loss, making it difficult for holes to become tapered. - Depending on conditions, can accommodate high aspect ratios of 1:20. 〇 Proposed Services - Contract processing from prototyping to mass production. - Equipment sales for in-house production at your company. We can offer a dual approach.
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Applications/Examples of results
Starting with the processing of ceramic substrates, it is widely used in semiconductor-related fields, as well as in applications for aircraft, automobiles, diamonds (tools, jewelry), and electronic components.
