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High-speed STEP & REPEAT type continuity and insulation testing equipment for HDI/PCB substrates.
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High-speed, high-precision 3D/2D/SD Wafer Bump Automatic Inspection System 'RWi-300MK3'
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3D Measurement Device for Glass Substrates 'NSAT Series' <High Speed, High Precision>
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Automatic inspection device for printed circuit boards with dual-side alignment mechanism 'STAR REC V5III'
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High-speed and high-precision inspection device for semiconductor packages 'GATS-7862'
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High-speed and high-precision inspection device for semiconductor packages 'GATS-7836'
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High-speed, high-precision inspection device for semiconductor packages 'GATS-7760'
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ニデックアドバンステクノロジー 本社、東京営業所、名古屋営業所
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