Product Categories
Products/Services（40items）
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【Semiconductor and Wafer Inspection】Ultra-high precision electroforming barrel (microtube)
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![[Semiconductor/Wafer Inspection] AI × Full-Color Image Inspection Device AURCA](https://image.mono.ipros.com/public/product/image/2009087/IPROS10607066819809733241.jpg?w=280&h=280)
[Semiconductor/Wafer Inspection] AI × Full-Color Image Inspection Device AURCA
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High-precision inspection equipment for large individual semiconductor packages.
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Large substrate HDI through-insulation inspection device 'GATS8360'
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Semiconductor package multi-surface full panel substrate inspection device
news list
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Notice of PCIM Shenzhen and THECA Exhibition
Our company will exhibit at: (1) "PCIM Asia Shenzhen 2026," held in Shenzhen, China from August 26 (Wednesday) to August 28 (Friday), and (2) "Thailand Electronics Circuit Asia (THECA) 2026," held in Bangkok, Thailand from August 26 (Wednesday) to August 28 (Friday). (1) PCIM We will introduce cutting-edge inspection technologies and inspection products related to next-generation power semiconductors such as IGBT/SiC. Main exhibits: Power semiconductor module/printed circuit board inspection equipment NATS series Venue: Shenzhen International Convention and Exhibition Center (Baoan Hall) (2) THECA We will propose comprehensive quality management solutions for circuit boards that are becoming more densely packed and complex. Additionally, we will showcase the latest X-ray inspection equipment that can clearly inspect complex electronic components and internal circuit boards for the first time in Thailand. Main exhibits: X-ray inspection equipment Venue: Shenzhen International Convention and Exhibition Center (Baoan Hall) Please be sure to visit our booth!
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Notice of Participation in TECHNO×FRONTIER 2026
We will be exhibiting at "TECHNO×FRONTIER 2026," which will be held at Tokyo Big Sight from July 15 (Wednesday) to July 17 (Friday), 2026. We plan to showcase our "TDAS series" equipment for performance and durability testing of EV/HEV onboard drive motors and E-Axles (integrated motor, inverter, and gear), as well as the latest models of IGBT/SiC inspection equipment. Please be sure to stop by our booth! 【Our booth number: 2-V03】
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Notice of Participation in JPCA Show 2026
Our company will be exhibiting at the "55th International Electronic Circuit Industry Exhibition (JPCA Show 2026)" to be held at Tokyo Big Sight from June 10 (Wednesday) to June 12 (Friday), 2026. We will also showcase our newly launched highlight products, the image inspection equipment series "AURCA" and TGV inspection equipment for glass substrate. Please be sure to visit our booth!
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We have joined the Semiconductor Backend Automation and Standardization Technology Research Association (SATAS)!
Nidec Advanced Technology Corporation is pleased to announce that it has joined the Semiconductor Assembly Test Automation and Standardization Research Association (SATAS). We are poised to engage in the SATAS’s R&D activities to contribute to establishing industry-wide standards. We will stay dedicated to constant technological development for the further development of the semiconductor industry.
Aboutニデックアドバンステクノロジー
本社、東京営業所、名古屋営業所
De facto standard of inspection functions.
Our inspection target areas include printed circuit boards, semiconductor packages, and display panels. These are core components of information and communication devices that are growing increasingly due to advancements in IT, as well as widely adopted digital home appliances. Printed circuit boards, semiconductor packages, and display panels are evolving at an astonishing speed, and higher precision technologies are required in inspections. Our company holds a significant share in these inspection fields that demand cutting-edge technology, and we have delivered numerous products recognized as "de facto standards" in the industry worldwide.