Notice of Participation in SEMICON Japan 2026

ニデックアドバンステクノロジー本社、東京営業所、名古屋営業所

We will be exhibiting at "SEMICON Japan 2026," which will be held at Tokyo Big Sight from December 9 (Wednesday) to December 11 (Friday), 2026. This time, we will showcase the comprehensive strength of "One Nidec" together with our group companies, Nidec Machine Tool and Nidec Instruments. We will introduce technologies that support the quality and productivity of semiconductor manufacturing. We will propose total solutions covering inspection technology, wafer processing and bonding, and transportation. Please be sure to visit our booth!

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Related product information

[Semiconductor/Wafer Inspection] AI × Full-Color Image Inspection Device AURCA
For manufacturing sites troubled by excessive detection. This inspection device accurately determines fine defects in wafers through AI analysis and full-color image inspection, achieving improved yield.

For more details, please check the PDF by downloading the "Catalog" below, or feel free to contact us.
Automated Transport System "EFEM Series"
Equipment Front End Module Full Panel Size Compatible Automatic Transporter

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