Ideal for application in semiconductor manufacturing equipment components! Characteristics explained clearly in a table!

The target of fluoropolymer coatings for semiconductor applications is primarily the components of semiconductor manufacturing equipment. The types of manufacturing equipment include cleaning devices, CMP devices, plating devices, transport and fixing applications, and exhaust and waste liquid systems. Fluoropolymer coatings are applied through melt bonding because they are thermoplastic resins. This means that the surface is leveled through melting, and there are virtually no gaps for particles to infiltrate. Similarly, the leveled surface maximizes the non-stick properties of the fluoropolymer, reducing the adhesion and carry-out of cleaning solutions, thereby increasing cleaning efficiency. From the above, we consider fluoropolymer coatings to be suitable surface treatments for cleaning devices. They are also actually used in various types of equipment. *For more details, please contact us or download and view the catalog.*

basic information

Price information

Delivery Time

Applications/Examples of results