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  • SEMINAR_EVENT

Introduction to Ultrasonic Application Devices / Welding, Joining, and Cutting Methods [Online Seminar]

日精

日精 本社

【Overview】 Date and Time: September 25 (Friday) 10:00 AM - 11:00 AM (Registration starts at 9:30 AM) Theme: Introduction to Adwells' Ultrasonic Application Devices / Welding, Joining, and Cutting Techniques Content: - Welding: A new technology for continuously welding CFRTP using ultrasonic waves. We will introduce applicable applications including processing examples and existing methods. - Joining: We will present technologies that solve challenges in metal joining for product development. - Cutting: We propose ultrasonic cutting for high-precision cutting of high-performance materials. It can cut rubber, resin, green sheets, etc., with high precision and without dragging burrs. - Seminar Participation Registration URL: https://www.nissei.co.jp/machinery - Product Overview Introduction Pages Ultrasonic Joining Device: http://ma.imsys.jp/r/1272880?m=0000&c=00000000 Ultrasonic Welding Device: http://ma.imsys.jp/r/1272879?m=0000&c=00000000 Ultrasonic Cutter: http://ma.imsys.jp/r/1272881?m=0000&c=00000000

  • Date and time Friday, Sep 25, 2020
    10:00 AM ~ 11:00 AM
    You can apply for participation from Nippon Seiki HP.
  • Entry fee Free

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