Ultrasonic welding device "Manufactured by Adwells Co., Ltd."
Achieved stable bonding through high-rigidity horn clamp technology (rigid clamp)!
basic information
We have introduced a lineup of bonding devices equipped with rigid clamp technology that achieves stable bonding for a wide range of applications, including dissimilar metals, IGBT, secondary batteries, thick wires, and coated fine wires. ■ Bonding device for power devices: UB1000MS This device is equipped with various functions for mass production of IGBT modules. 1. Capillary method adopted (supports low running costs for high step difference work specific to IGBT) 2. Terminal recognition and terminal inspection functions included ■ Bonding device for secondary batteries: UP-Lite1500 This device is designed with the premise of being integrated into automatic machines. 1. Available with single support and double support horns 2. Available in lower drive and upper drive types that are easy to integrate into automatic machines ■ Bonding devices for wires: UB2000LS/UB050SA/UB500CE Devices that support wire bonding from thick wires to coated fine wires 1. High load type 2000N supports thick wire bonding 2. Low load type 50N offers an easy-to-install device size for coated fine wire bonding on-site ■ Flip chip mounting bonding device: UB1000LS This is a flip chip mounting device that precisely mounts semiconductors. 1. Implementation possible at room temperature in a short time using ultrasonic process 2. Equipped with calibration functions that achieve stable alignment
Price information
Delivery times may vary depending on the product and product specifications, so please feel free to contact us.
Price range
P7
Delivery Time
OTHER
Delivery times may vary depending on the product and product specifications, so please feel free to contact us.
Model number/Brand name
UB Series, UP-Lite Series
Applications/Examples of results
IGBT, connector, electric wire, flat cable, inductor, temperature sensor, catheter, LIB, all-solid-state battery, next-generation secondary battery
Detailed information
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Supports the specific high step work of IGBT.
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Terminal recognition and terminal inspection function equipped.
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Support for single and dual support horns in the lineup.
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A lineup that is easy to incorporate into automatic machines in the form of lower drive and upper drive types.
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Supports thick wire connections with a high load capacity of 2000N.
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A low-load type 50N device that is easy to install on-site for thin film bonding.
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Implementation at room temperature and in a short time is possible with the ultrasonic process.
Line up（5）
| Model number | overview |
|---|---|
| UB1000MS | |
| UB1000LS | |
| UP-Lite1500 | |
| UB2000 | |
| UB050SA/UB500CE |
