Various semiconductor/substrate-related equipment
Various semiconductor/substrate-related equipment
Various semiconductor/substrate-related equipment
1～28 item / All 28 items
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High-precision flip chip bonder "Athlete FA (manufactured by Asurito Co., Ltd.)"
It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.
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Low-cost compound microscope
Achieving high performance at a low cost compared to conventional binocular stereo microscopes! We can offer it at about half the price of other companies' binocular stereo microscopes.
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Tabletop UV irradiation device (top and bottom irradiation type) *Demo unit available for loan
Both upper and lower surfaces can be UV irradiated. Even with an affordable version that is easy to use, we thoroughly pursue cost-effectiveness (effectiveness) in curing.
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[Compact & Lightweight] UV (Ultraviolet) Irradiation Device - Dual-Sided Irradiation Type
A compact curing device that can be used on a tabletop. It allows for both top and bottom irradiation, and its affordable price is also attractive! *Demo units available for loan.
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[Compact & Lightweight] UV-LED Irradiation Device
A compact LED curing device that can be used on a tabletop. It can emit light from both the top and bottom, and its affordable price is also attractive! *Demo units available for loan.
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Formic Acid and Hydrogen Reduction Compatible Tabletop Vacuum Solder Reflow Device RSO-200
A super high-speed heating model capable of a maximum heating rate of 600 K/min, suitable for metal sintering. Manufactured by Unitemp Japan.
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Formic Acid and Hydrogen Reduction Compatible Tabletop Vacuum Solder Reflow Device VSS-300
300mm square compatible model. Can be linked with loaders and unloaders for mass production. Made by Unitec Japan.
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Formic Acid and Hydrogen Reduction Compatible Vacuum Solder Reflow Device RSS-210-S
Standard model that achieves high-reliability mounting such as fluxless, void-free, and lead-free. Made by Unitec Japan.
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Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-160-S
Standard model achieving high-reliability assembly such as fluxless, void-free, and lead-free. Manufactured by Unitec Japan.
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Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-110-S
Standard model that achieves high-reliability implementation such as fluxless, void-free, and lead-free. Manufactured by Unitec Japan.
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10X Optical Zoom Microscope AZ9T/AZ9C
A microscope capable of real-time observation and recording inside the chamber in conjunction with the main body. Manufactured by Unitec Japan.
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RTP-100 High-Speed Annealing Heating System for Φ4 Compatible Vacuum and Process Gas
This is an annealing furnace manufactured by Unitemp Japan, applicable to a wide range of applications requiring rapid and uniform heat treatment, including the crystal growth of GaN.
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Φ6 Compatible Vacuum/Process Gas High-Speed Annealing Heating System RTP-150
This is an annealing furnace that can be applied to a wide range of applications requiring rapid and uniform heat treatment, including the crystal growth of GaN. Manufactured by Unitemp Japan.
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Φ12 compatible high-speed annealing heating system VPO-1000-300
This is an annealing furnace that can be applied to a wide range of applications requiring rapid and uniform heat treatment, including the crystal growth of GaN. 【Testable】
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Manual Flip Chip Bonder CB-505 Athlete FA Model
Manual flip chip bonder suitable for small-scale production and various experiments.
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Standard Type Clean Roller "RY Series"
It is a dust removal device suitable for both inline and outline applications. We offer a range from 2 to 5 units.
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Clean Roller "RY Series" Thin Plate Compatible Type
Dust removal device compatible with thin plates. Equipped with a magnetic gear in the drive unit! This single unit can accommodate a wide range of substrate thicknesses.
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Dust Removal Roll to Roll RUTR Series
We would like to propose a unit roller that meets your specifications.
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High-precision semi-auto FC bonder 'CB-700 (Athlete FA model)'
Semi-auto FCB (Flip Chip Bonder) that meets a wide range of user needs.
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Inline Laser Marking System "LMS-K500 Series"
Lasers can be selected from three types: CO2, YVO4, and UV, depending on the application! Equipped with a 3D laser marker that can mark large areas with high quality.
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EMS (Electronic Manufacturing Services)
From livelihood machinery to industrial equipment! Connecting and integrating the strengths of each business location across a wide range of fields through a network!
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12-inch (300mm) wafer compatible LED UV irradiator
A compact LED curing device that can be used on a tabletop. It offers irradiation capabilities and is attractively priced! *Demo units available for loan.
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High-Precision Die Bonder "AB-1000" <Manufactured by Athlete FA>
High-speed Die Bonder compatible with micro and thin chips!
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Single-board compatible microball-equipped machine 'BM-3500SI'
A new microball system that meets individual piece needs! Reduces ball consumption.
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Wafer-compatible Micro Ball Mounter BM-1310W
Achieves high-speed and stable solder ball mounting with a unique solder ball mounting method!
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Wafer-Compatible Micro Ball Inspection Repair System BM-1150WR
Reliable solder ball repairs are performed by a repair unit that has accumulated unique image processing and proven results.
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Substrate-Compatible Inline System BM-2100SI Plus
Features stable solder ball mounting and improves productivity through an inline system.
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Micro Ball Inspection Repair System for Substrates BM-2150SR
Reliable solder ball repair is performed using high-speed image processing and a uniquely developed repair unit.
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