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The "RSS-160-S" is a desktop vacuum solder reflow device suitable for solving challenges related to no-clean flux, void removal, and lead-free processes. In addition to conventional "flux" and "hydrogen reduction," it also supports reduction using "formic acid." With the powerful reducing action of formic acid, it effectively removes oxide films from metal surfaces such as substrates, achieving improved wettability without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. Despite its compact design, which is among the smallest in the industry, it condenses various functions and performance to support a wide range of prototype development. 【Features】 ■ Rapid heating at 100°C per minute, and with water cooling, significantly reduces takt time ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly achieves the set temperature profile as is, with high repeatability and almost zero overshoot ■ The in-plane temperature difference on the heating plate is close to zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

【Specifications (Excerpt)】 ■Device Size (WxDxH): 300x420x220mm ■Device Weight: Approximately 12kg ■Effective Object Size (WxDxH): 155mmx155mmx40mm ■Maximum Reach Temperature: 400℃ ■Heating Method: IR Heater (Bottom Heating) ■Temperature Control Method: P.I.D. Control Method ■Temperature Difference on Plate Surface: Within ±1% of Set Temperature (Object: Φ200mm Wafer) ■Maximum Heating Rate (Depends on Object's Heat Capacity): 100K/min. ■Maximum Cooling Rate (Depends on Object's Heat Capacity): 100K/min. (T=400℃>200℃) ■Chamber Vacuum Durability: 0.1Pa (10-3hPa) ■Process Gas Supply Line: Mass Flow Controller x1 (Maximum Flow Rate: 5nlm) ■Controller: Touch Panel Controller SIMATIC TP-700 ■Number of Profile Program Registrations: Up to 50 Programs ■Number of Program Steps: Up to 50 Steps ■Chamber Cooling Method: Water Jacket Method ■Heating Plate Cooling Method: Water Cooling/Air Cooling (Can be Shared) *For more details, please refer to the PDF document or feel free to contact us.

5 million to 15 million yen (depending on the model and options)

The delivery time is approximately 3 to 4 months from the confirmation of your order (please contact us for more details, as the delivery time may vary depending on the situation).

RSS-160-S

【Applications】 ■ Solder reflow assembly without using flux ■ Functional materials development field (battery electrodes, conductive film materials, etc.) ■ Redox of metal surfaces such as electrodes and metal powders ■ Redox during sintering of silver nano and copper nano pastes (not just prevention) 【Delivery Achievements】 ■ Automotive industry (power devices for EV/HV and high-brightness LED assembly) ■ Medical applications (pacemakers, endoscopes, etc.) ■ Aerospace development industry (radar, artificial satellites, rockets, etc.) ■ Government-affiliated research institutions such as AIST and NICT, as well as national universities and private universities in engineering fields *For more details, please refer to the PDF materials or feel free to contact us.