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The "RSS-210-S" is a desktop vacuum solder reflow device that is suitable for solving challenges related to no-clean flux, void removal, and lead-free processes. It supports traditional "flux," "hydrogen reduction," and reduction using "formic acid." With the powerful reducing effect of formic acid, it effectively removes the oxide film on metal surfaces such as substrates, achieving improved wettability even without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. With a variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting that meets the standards required for power devices and aerospace applications. 【Features】 ■ Rapid heating at 4°C per second, significantly reducing takt time due to water cooling ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Almost perfectly realizes the set temperature profile, with high repeatability and nearly zero overshoot ■ The in-plane temperature difference on the heating plate is close to zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

【Specifications (Excerpt)】 ■Device Size (WxDxH): 430x295x290mm ■Device Weight: Approximately 22kg ■Effective Object Size (WxDxH): 200mmx200mmx50mm ■Maximum Reachable Temperature: 400℃ ■Heating Method: IR Heater (Bottom Heating) ■Temperature Control Method: P.I.D. Control Method ■Temperature Difference on Plate Surface: Within ±1% of Set Temperature (Object: Φ200mm Wafer) ■Maximum Heating Rate (Depends on Object's Heat Capacity): 240K/min. ■Maximum Cooling Rate (Depends on Object's Heat Capacity): 120K/min. (T=400℃>200℃) ■Chamber Vacuum Durability: 0.1Pa (10-3hPa) ■Process Gas Supply Line: Mass Flow Controller x1 (Maximum Flow Rate: 5nlm) ■Controller: 7-inch Touch Panel Controller (SIMATIC TP-700) ■Number of Profile Program Registrations: Up to 50 Programs ■Number of Program Steps: Up to 50 Steps ■Chamber Cooling Method: Water Jacket Method ■Heating Plate Cooling Method: Water Cooling/Air Cooling (Can be Shared) *For more details, please refer to the PDF document or feel free to contact us.

5 million to 15 million yen (depending on the model and options)

The delivery time is approximately 3 to 4 months from the confirmation of your order (please contact us for more details as the delivery time may vary depending on the situation).

RSS-210-S

【Applications】 ■ Solder reflow mounting without using flux ■ Functional materials development field (battery electrodes, conductive film materials, etc.) ■ Redox of metal surfaces such as electrodes and metal powders ■ Redox during sintering of silver nano and copper nano pastes (not just prevention) 【Delivery Achievements】 ■ Automotive industry (power devices for EV/HV and high-brightness LED mounting) ■ Medical applications (pacemakers, endoscopes, etc.) ■ Aerospace development industry (radar, artificial satellites, rockets, etc.) ■ Government-affiliated research institutions such as AIST and NICT, as well as national universities and private universities in engineering departments *For more details, please refer to the PDF materials or feel free to contact us.