Manual Flip Chip Bonder CB-505 Athlete FA Model
Manual flip chip bonder suitable for small-scale production and various experiments.
The "CB-505" supports various packages (*1) and various bonding processes (*2) due to its highly versatile device concept. *1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. *2 ACF, ACP, NCF, NCP, ultrasonic, etc. *For more details, please refer to the PDF materials or feel free to contact us.
basic information
■Response Process 1. Heat Press Bonding 2. Ultrasonic Welding ■Alignment of the chip and substrate is performed on the same screen, achieving extremely high bonding position accuracy. *For more details, please refer to the PDF document or feel free to contact us.*
Price information
It may vary due to optional features, so please feel free to contact us.
Price range
P7
Delivery Time
OTHER
Please feel free to contact us. (Negotiable)
Model number/Brand name
Flip Chip Bonder CB-505
Applications/Examples of results
【Applications】 ■Compatible with various packages in fields such as MEMS, 5G, data communication, millimeter-wave sensors, photonics, and AR. ■Customized with a variety of options, available for purchase by individuals in a wide range of fields, including universities, government agencies, and corporate R&D. *For more details, please refer to the PDF document or feel free to contact us.
Line up（3）
| Model number | overview |
|---|---|
| CB-200 | Desktop Flip Chip Bonder https://www.ipros.jp/product/detail/2000558584 |
| CB-600 | High Precision, Low Load Flip Chip Bonder https://www.ipros.jp/product/detail/2000554324 |
| CB-700 | Ultra High Precision Flip Chip Bonder |
