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The "RSO-200" is a desktop vacuum solder reflow device that enables a void-free rate of up to 0.01%, making it suitable for solving challenges related to no-clean and lead-free soldering. In addition to "hydrogen reduction" for removing oxide films from the metal surfaces to be joined, it also supports "formic acid reduction." The powerful reducing effect of formic acid enhances wettability even without flux. Moreover, despite its compact design, which is among the smallest in the industry, it condenses various functions and performance to accommodate a wide range of prototype development. With its diverse reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace development. 【Features】 ■ Ultra-fast heating rate of 10°C per second, significantly reducing takt time with water cooling ■ Supports maximum temperature of 650°C ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly achieves the set temperature profile as is, with high repeatability and almost zero overshoot ■ The in-plane temperature difference on the heating plate is nearly zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF document or feel free to contact us.

【Specifications (Excerpt)】 ■Device Size (WxDxH): 505x505x570mm ■Device Weight: Approximately 55kg ■Effective Object Size (WxDxH): 155mmx155mmx40mm ■Maximum Reach Temperature: 650℃ ■Heating Method: Cross-arranged IR heater (bottom heating) ■Temperature Control Method: P.I.D. control method ■Temperature Difference on Plate Surface: Within ±1% of the set temperature (when object is Φ200mm wafer) ■Maximum Heating Rate (depending on the thermal capacity of the object): 600K/min. ■Maximum Cooling Rate (depending on the thermal capacity of the object): 200K/min. (T=650℃>400℃), 60K/min. (T=200℃>100℃) ■Chamber Vacuum Durability: 0.1Pa (10-3hPa) ■Process Gas Supply Line: Mass flow controller x1 (maximum flow rate: 5nlm) ■Controller: 7-inch touch panel controller (SIMATIC TP-700) ■Number of Profile Program Registrations: Up to 50 programs ■Number of Program Steps: Up to 50 steps ■Chamber Cooling Method: Water jacket method *For more details, please refer to the PDF document or feel free to contact us.

5 million to 15 million yen (depending on the model and options)

The delivery time is approximately 3 to 4 months from the confirmation of your order (please contact us for more details as the delivery time may vary depending on the situation).

RSO-200

【Applications】 ■ Solder reflow assembly without using flux ■ Functional material development fields (battery electrodes, conductive film materials, etc.) ■ Redox of metal surfaces such as electrodes and metal powders ■ Redox during sintering of silver nano and copper nano pastes (not just prevention) 【Delivery Achievements】 ■ Automotive industry (power devices for EV/HV and high-brightness LED assembly) ■ Medical applications (pacemakers, endoscopes, etc.) ■ Aerospace development industry (radar, artificial satellites, rockets, etc.) ■ Government-affiliated research institutions such as AIST and NICT, as well as national universities and private universities with engineering faculties *For more details, please refer to the PDF materials or feel free to contact us.