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This product is a tabletop vacuum solder reflow device that enables a maximum of 0.01% void-free soldering, making it suitable for addressing challenges related to fluxless and lead-free applications. It supports the removal of oxide films on the metal surfaces to be joined through "hydrogen reduction" and "formic acid reduction." The powerful reducing effect of formic acid enhances wettability even without flux. Additionally, despite its compact design, which is among the smallest in the industry, it consolidates the functions and performance needed for everything from prototype development to mass production into a single unit. With a wide variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace development. **Features** - Rapid heating at a speed of 2.5°C per second, significantly reducing takt time with water cooling - Maximum reachable temperature of 450°C (optional up to 650°C) - Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen - Almost perfectly realizes the set temperature profile, with high repeatability and nearly zero overshoot - The in-plane temperature difference on the heating plate is nearly zero, allowing for uniform heating of large workpieces *Free demo requests are also accepted. Please feel free to contact us.* *For more details, please refer to the PDF materials or feel free to reach out to us.*

【Specifications (Excerpt)】 ■Device Size (WxDxH): 550mm × 690mm × 830mm ■Device Weight: Approximately 105kg ■Effective Object Size (WxDxH): 300mm × 300mm × 50mm ■Maximum Reach Temperature: 450℃ ■Heating Method: Cross-arrangement IR heater (bottom heating) ■Temperature Control Method: P.I.D. control method ■Temperature Difference on Plate Surface: Within ±1% of set temperature (Object: Φ300mm wafer) ■Maximum Heating Rate (depending on the thermal capacity of the object): 150K/min. ■Maximum Cooling Rate (depending on the thermal capacity of the object): 90K/min. (T=450℃>200℃), 60K/min. (T=200℃>100℃) ■Chamber Vacuum Durability: 0.1Pa (10-3hPa) ■Nitrogen Gas: 0.35 to 0.4MPa (3.5 to 4bar) ■Controller: 7-inch touch panel controller (SIMATIC TP-700) ■Number of Profile Program Registrations: Up to 50 programs ■Chamber Cooling Method: Water jacket method ■Heating Plate Cooling Method: Water cooling/Air cooling (can be shared) *For more details, please refer to the PDF document or feel free to contact us.

5 million to 15 million yen (depending on the model and options)

The delivery time is approximately 3 to 4 months from the confirmation of your order (please contact us for more details, as the delivery time may vary depending on the situation).

VSS-300

【Applications】 ■ Solder reflow mounting without using flux ■ Functional material development fields (battery electrodes, conductive film materials, etc.) ■ Redox of metal surfaces such as electrodes and metal powders ■ Redox during sintering of silver nano and copper nano pastes (not just prevention) 【Delivery Achievements】 ■ Automotive industry (power devices for EV/HV and high-brightness LED mounting) ■ Medical applications (pacemakers, endoscopes, etc.) ■ Aerospace development industry (radar, satellites, rockets, etc.) ■ Government-affiliated research institutions such as AIST and NICT, as well as national universities and private universities in engineering departments *For more details, please refer to the PDF materials or feel free to contact us.