Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-110-S
Standard model that achieves high-reliability implementation such as fluxless, void-free, and lead-free. Manufactured by Unitec Japan.
The "RSS-110-S" is a desktop vacuum solder reflow device suitable for solving challenges related to no-clean, void removal, and lead-free processes. It supports traditional "flux," "hydrogen reduction," and reduction using "formic acid." With the powerful reducing action of formic acid, it effectively removes oxide films from metal surfaces such as substrates, achieving improved wettability even without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. With a variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace applications. 【Features】 ■ Rapid heating at 2°C per second, significantly reducing takt time due to water cooling ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly exact realization of the set temperature profile High repeatability with almost zero overshoot ■ Minimal in-plane temperature difference on the heating plate, allowing uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.
basic information
【Specifications (Excerpt)】 ■Device Size (WxDxH): 260mm x 420mm x 220mm ■Device Weight: Approximately 10kg ■Effective Object Size (WxDxH): 105mm x 105mm x 40mm ■Maximum Reachable Temperature: 400℃ ■Heating Method: Cross-Array IR Heater (Bottom Heating) ■Temperature Control Method: P.I.D. Control Method ■Temperature Difference on Plate Surface: Within ±1% of Set Temperature (Object: Φ100mm Wafer) ■Maximum Heating Rate (Depends on Object's Heat Capacity): 120K/min. ■Maximum Cooling Rate (Depends on Object's Heat Capacity): 180K/min. (T=450℃>200℃) ■Chamber Vacuum Durability: 0.1Pa (10-3hPa) ■Nitrogen Gas: 0.35 to 0.4MPa (3.5 to 4bar) ■Controller: 7-inch Touch Panel Controller (SIMATIC TP-700) ■Number of Profile Program Registrations: Up to 50 Programs ■Number of Program Steps: Up to 50 Steps ■Chamber Cooling Method: Water Jacket Method ■Heating Plate Cooling Method: Water Cooling/Air Cooling (Can be Shared) *For more details, please refer to the PDF document or feel free to contact us.
Price information
5 million to 15 million yen (depending on the model and options)
Delivery Time
Model number/Brand name
RSS-110-S
Applications/Examples of results
【Applications】 ■ Solder reflow assembly without using flux ■ Functional materials development field (battery electrodes, conductive film materials, etc.) ■ Redox of metal surfaces such as electrodes and metal powders ■ Redox during sintering of silver nano and copper nano pastes (not just prevention) 【Delivery Achievements】 ■ Automotive industry (power devices for EV/HV and high-brightness LED assembly) ■ Medical applications (pacemakers, endoscopes, etc.) ■ Aerospace development industry (radar, satellites, rockets, etc.) ■ Government-affiliated research institutions such as AIST and NICT, as well as national universities and private universities with engineering faculties *For more details, please refer to the PDF materials or feel free to contact us.
Line up（7）
| Model number | overview |
|---|---|
| VSS-300 | |
| RSO-200 | |
| RVS-210 | |
| RSS-3×210-S | |
| RSS-210-S | |
| RSS160-S | |
| RSS110-S |
