High-Precision Die Bonder "AB-1000" <Manufactured by Athlete FA>
High-speed Die Bonder compatible with micro and thin chips!
We would like to introduce the high-precision die bonder "AB-1000" manufactured by Athlete FA, which we handle. It achieves mounting accuracy of XY: ±5[μm], θ: ±1[deg] (±3σ). It is compatible with small and thin chips. It comes with calibration, traceability, and post-mount inspection functions. Please feel free to contact us if you have any requests. 【Features】 ■ Achieves high-precision mounting ■ Compatible with small and thin chips ■ Equipped with calibration function ■ Equipped with traceability function ■ Equipped with post-mount inspection function *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Basic Specifications】 ■ Mounting Accuracy: XY: ±5[μm], θ: ±1[deg] (±3σ) ■ Target Workpieces ・Substrate Supply Form: 8-inch wafer, 12-inch wafer ・Die Size (Substrate Side): MAX □2.5(mm) ・Chip Supply Form: 6/8 inch wafer ・Chip Size: □0.15 to □1(mm) ■ Pressing Load: 0.2 to 1(N) ■ External Dimensions: 1600W x 1920D x 1700H (mm) ■ Weight: 2100(kg) *For more details, please refer to the PDF document or feel free to contact us.
Price information
Please feel free to contact us.
Price range
P8
Delivery Time
OTHER
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Model number/Brand name
Die Bonder AB-1000
Applications/Examples of results
[Applications] ■ Compatible with various packages in fields such as millimeter-wave sensors, photonics, and the automotive industry. *For more details, please refer to the PDF document or feel free to contact us.*
