High-precision semi-auto FC bonder 'CB-700 (Athlete FA model)'
Semi-auto FCB (Flip Chip Bonder) that meets a wide range of user needs.
The "CB-700 (Athlete FA model)" is an all-in-one FC bonder for R&D purposes. It features an advanced interactive MMIF interface that enhances operability. With high precision (±0.5μm [3σ]) and a wide load range (0.05 to 1000N) as its foundation, it accommodates various applications and broadly meets the needs of R&D. 【Features】 ■ Extremely low load capability and high precision bonding ■ Tool lift operation utilizing high precision Z-axis control ■ Capable of ultrasonic bonding with tool exchange ■ Suitable for process development *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Specifications】 ■Supported Processes ・ACF/ACP ・NCF/NCP ・Au-Sn (Eutectic) ・Au-Au (Ultrasonic) ・Solder Bump ・Ag Sintering ■Mounting Accuracy: ±0.5μm ■Target Workpieces ・Stage Size: □200mm Panel / 8-inch Wafer ・Chip Size: 0.3 to 20mm ■Load: 0.05 to 1000N (No need to change the head depending on the load range) ■Various options available (please contact us for details) *For more information, please refer to the PDF document or feel free to contact us.
Price information
It may vary due to optional features, so please feel free to contact us.
Price range
P8
Delivery Time
OTHER
Please feel free to contact us. (Negotiable)
Model number/Brand name
Flip Chip Bonder CB-700
Applications/Examples of results
【Applications】 ■Various packages for MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. ■Customized with a variety of options, provided mainly for R&D, including overseas users. *For more details, please refer to the PDF document or feel free to contact us.
