High-precision flip chip bonder "Athlete FA (manufactured by Asurito Co., Ltd.)"
It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.
It enables bonding control at low loads compared to conventional flip chip bonding, significantly reducing load and stress damage to bumps, aluminum pads, wiring, and more. The thermal shrinkage compensation function during cooling prevents failures such as cracks and disconnections, achieving a high-yield, highly reliable bonding process. Moreover, it is an innovative system capable of achieving bonding with high precision of ±1μm at 3σ.
basic information
■Specifications Board dimensions 5 to 100 mm x 5 to 235 mm Chip size □1 to 20 mm Mounting accuracy XYZ ±1μm (3σ)
Price range
Delivery Time
Applications/Examples of results
Process ● ACF/ACP ● NCF/NCP ● Au-Sn (eutectic) ● Au-Au (ultrasonic) ● Solder bump Chip types ● Large chip - CMOS image sensor ● Fine pitch - driver IC ● Brittle materials - compound semiconductor ● Small chip - analog IC
