Ultrasonic cutting device "Manufactured by Takada Kogyo Co., Ltd."
Dicing device "CSX-400 series" that efficiently cuts difficult materials such as brittle materials and composites by adding ultrasonic vibrations.
The CSX-400 series is a dicing device that incorporates ultrasound to fragment wafers and integrated substrates into chips and individual substrates. By hybridizing ultrasound at the tip of the rotating blade, it achieves the ability to "hit with ultrasound and pull with rotation," not just relying on the "pulling action from rotational force" typical of conventional dicing processes. This technology generates many advantages not found in standard dicing methods. Additionally, we have prepared a demo environment for you to try out this ultrasound-enhanced cutting method, especially if you are facing challenges such as "lack of cutting methods" in the development of next-generation products. Please feel free to contact us.
basic information
■Compatible work sizes: 6 inches, 8 inches ■Conveying mechanism: In-house manufactured conveying mechanism ■Device specifications: Semi-auto, full-auto ■Inline, pre-cut function (optional) ■Compatible with upper-level communication ■Standard equipped with auto-alignment mechanism ■Multi-recipe support
Price range
P7
Delivery Time
OTHER
Applications/Examples of results
We have received numerous adoptions from customers in the power electronics sector for products manufactured using SiC wafers. In addition to SiC, we also contribute to the processing of difficult-to-cut materials and the reduction of manufacturing costs in the dicing processes of ceramics, glass, and quartz.
