Lead frame appearance inspection device
Achieving automatic visual inspection of lead frames and die bond chips! Compatible with high-resolution inspection!
This is an automatic visual inspection device for lead frames capable of high-precision 2D defect inspection. In addition to lead frames, it can also inspect defects on die-bond chips on the lead frames. You can choose from high-resolution inspection-compatible cameras ranging from 4M to 25M pixels, and it enables high-precision 2D defect inspection with multi-angle LED lighting and multiple image captures. It reliably detects various defect modes. 【Features】 ■ Supports inline inspection ■ Maintains a clean environment inside the device with downflow from a clean fan ■ Outputs inspection results using MAP data *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Main Specifications】 ■Target Devices: Compatible with various lead frame products ■Target Device Size: Up to 80×240mm ■Target Magazine: Compatible with various magazines (magazine size to be discussed separately) ■Inspection Field: □23mm (can be changed depending on the inspection target) ■Resolution: 4.5μm/pix (for inspection field □23mm, using a 25Mpix camera) 【Inspection Items】 ■Appearance inspection of lead frames - Foreign objects on bonding pads - Solder splashes on chip surfaces ■Appearance inspection of lead frames - Foreign object adhesion - Lead defects, lead burrs - Etching defects - Plating defects, plating misalignment - Scratches, chips, abrasions - Dents - Bending *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Purpose】 ■Automatic visual inspection of lead frames and die-bonded chips *For more details, please refer to the PDF document or feel free to contact us.*
