2D/3D Visual Inspection Equipment for Automotive Semiconductor ICs

2D/3D Visual Inspection Equipment for Automotive Semiconductor ICs

Elimination of visual inspection for automotive semiconductor ICs! High-precision defect inspection with 3D/2D dimensional inspection.

This is a high-performance appearance inspection device for automotive semiconductor ICs that enables all-direction inspection of devices. With 3D/2D dimensional inspection, it allows for high-precision defect detection on both sides of leads, balls, and mold surfaces. It can perform high-speed imaging of up to 20 frames with a 25M camera and 7-channel individual volume control, and by using multi-angle lighting and multiple images, it can eliminate dents and extract foreign objects, reliably capturing targeted defects such as root metal foreign objects, foreign objects on leads, and voids on mold sides. Additionally, it removes detected foreign objects using dry ice, restoring defective products to good condition. 【Features】 ■ 3D/2D dimensional inspection ■ Accurate 3D measurement using phase shift method ■ Reliable capture of targeted defects with multi-angle lighting and multiple images ■ Removal of detected foreign objects using dry ice, restoring defective products to good condition ■ Realization of all-direction inspection of devices by adding a side inspection stage *For more details, please refer to the PDF materials or feel free to contact us.

basic information

【Specifications】 ■Target Devices - BGA, CSP, LGA: 3×3 to 30×30mm - QFP, SOP: 5×5 to 35×35mm - QFN: 3×3 to 12×12mm ■Target Ball Diameter/Ball Pitch: Φ0.15mm or larger / 0.3mm pitch or larger ■Target Trays: JEDEC, JEITA trays ■Inspection Items <BGA/CSP> - Warpage, terminal height, stand-off, warping, overall height, terminal center position, terminal diameter, overall length/width, package center offset, package edge, positional accuracy A, terminal pitch offset <QFP/SOP> - Warpage, stand-off, warping, overall height, lead positional accuracy, lead pitch, lead width, lead tip variation, overall length/width, slant A/B <QFN> - Warpage, stand-off, warping, overall height, lead positional accuracy, lead pitch, lead length, lead width, lead tip variation, overall length/width <Defect Inspection> - Side defects (substrate delamination, voids), foreign matter between leads, foreign matter on lead front/back, resin defects, ball defects, foreign matter between balls, marking inspection *For more details, please refer to the PDF document or feel free to contact us.