Ultrasonic cutting device for sample preparation for cross-section and SEM observation.
No resin embedding! Achieving efficiency in cross-section sample preparation without the need for skills. Contributing to the efficiency of SEM observation. 'Ultrasonic Cutting Device CSX-100Lab'
The cross-section sample preparation device "CSX-100Lab" is a specialized device that utilizes the cutting surface polishing effect (PolishCut) of our uniquely developed "ultrasonic cutting technology" to simultaneously perform "cutting" and "polishing." It is ideal for improving the efficiency of cross-sectional observation, failure analysis, defect analysis, structural analysis, and verification of manufacturing conditions. Features include: 1) clean cross-sections, 2) precise cutting at targeted positions, 3) cutting of invisible objects by overlaying drawings or X-ray images with monitor images (skeleton cut option), 4) skill-free cross-section sample preparation, 5) reduction of milling time when used as a pre-treatment device for ion milling during SEM observation, and 6) cross-sectional observation of small chip components like 0402. It is particularly used in situations where many cross-section samples are prepared. We also have a demo environment where you can evaluate the actual cutting of your samples, so please feel free to contact us!
basic information
【Specifications】 ■Compatible work sizes: φ100mm, 75mm square ■Cutting height: 9mm ■Device dimensions: 640W mm × 900D mm × 1,350H mm (Excluding protrusions, warning lights, and monitor 80W mm, 350H mm) ■Device weight: 380kg *For more details, please refer to the PDF document or feel free to contact us.
Price information
The price varies depending on the desired accessories and options, so please contact us.
Price range
P7
Delivery Time
OTHER
Model number/Brand name
Ultrasonic Cutting Device for Cross-Section Observation CSX-100Lab
Applications/Examples of results
【Purpose】 - Streamlining the production of cross-sectional samples - Reducing the time from ion milling to SEM observation as a preprocessing device - Defect analysis, good product analysis, structural analysis - Verification of manufacturing conditions - Interface confirmation 【Track Record】 - Approximately 100 units in operation domestically and internationally - Widely adopted by semiconductor manufacturers, electronic component manufacturers, analytical equipment manufacturers, electronic materials manufacturers, automotive manufacturers, and many others.
