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The RVS-210 is a tabletop vacuum solder reflow device that enables a maximum of 0.01% void-free soldering, making it suitable for solving challenges related to no-clean and lead-free processes. In addition to "hydrogen reduction" for removing the oxide layer on the metal surfaces to be joined, it also supports "formic acid reduction." The powerful reducing effect of formic acid improves wettability even without flux. Despite its compact design, which is among the smallest in the industry, it condenses all the necessary functions and performance for various prototype developments into one unit. With a wide range of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace applications. **Features** - Rapid heating at a speed of 2°C per second, significantly reducing takt time due to water cooling - Supports a maximum temperature of 400°C - Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen - Almost perfectly realizes the set temperature profile with high repeatability and minimal overshoot - The in-plane temperature difference on the heating plate is close to zero, allowing for uniform heating of large workpieces *Free demo requests are also accepted. Please feel free to contact us.* *For more details, please refer to the PDF document or feel free to contact us.*

【Specifications (Excerpt)】 ■Device Size (WxDxH): 670x544x320mm ■Device Weight: Approximately 45kg ■Effective Object Size (WxDxH): 200mmx200mmx50mm ■Maximum Reachable Temperature: 400℃ ■Heating Method: IR Heater (Bottom Heating) ■Temperature Control Method: P.I.D. Control Method ■Temperature Difference on Plate Surface: Within ±1% of Set Temperature (Object: Φ200mm Wafer) ■Maximum Heating Rate (Depends on Object's Heat Capacity): 120K/min. ■Maximum Cooling Rate (Depends on Object's Heat Capacity): 120K/min. (T=400℃>200℃) ■Chamber Vacuum Durability: 0.1Pa (10-3hPa) ■Process Gas Supply Line: Mass Flow Controller x1 (Maximum Flow Rate: 5nlm) ■Controller: 7-inch Touch Panel Controller (SIMATIC TP-700) ■Number of Profile Program Registrations: Up to 50 Programs ■Number of Program Steps: Up to 50 Steps ■Chamber Cooling Method: Water Jacket Method ■Heating Plate Cooling Method: Water Cooling/Air Cooling (Can be Shared) *For more details, please refer to the PDF document or feel free to contact us.

5 million to 15 million yen (depending on the model and options)

The delivery time is approximately 3 to 4 months from the order confirmation (please contact us for more details as the delivery time may vary depending on the situation).

RVS-210

【Applications】 ■ Solder reflow assembly without using flux ■ Functional materials development field (battery electrodes, conductive film materials, etc.) ■ Redox of metal surfaces such as electrodes and metal powders ■ Redox during sintering of silver nano and copper nano pastes (not just prevention) 【Delivery Achievements】 ■ Automotive industry (power devices for EV/HV and high-brightness LED assembly) ■ Medical applications (pacemakers, endoscopes, etc.) ■ Aerospace development industry (radar, artificial satellites, rockets, etc.) ■ Government-affiliated research institutions such as AIST and NICT, as well as national universities and private universities in engineering departments *For more details, please refer to the PDF document or feel free to contact us.