High-precision low-load flip chip bonder CB-600 by Athlete FA
Achieving a mounting accuracy of ±1 [μm] and an ultra-low load of 0.049 [N]! High-precision bonding compatible with extremely low loads.
The "CB-600" is a flip chip bonder designed for ultra-low load applications. It enables heating and bonding from room temperature to 450°C through a tool lift operation that utilizes high-precision Z-axis control, with a ceramic heater. With a head exchange, it also supports ultrasonic bonding (customer replaceable). Additionally, due to its highly versatile equipment concept, it accommodates various packages (*1) and bonding processes (*2). *1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. *2 ACF, ACP, NCF, NCP, solder, ultrasonic, etc. 【Features】 ■ Ultra-low load compatibility ■ High-precision bonding ■ Tool lift operation utilizing high-precision Z-axis control ■ Supports ultrasonic bonding with tool exchange *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Overview】 ■ Response Process 1. Heat Pressing 2. Ultrasonic Joining ■ Automatic Tool Exchange Function (when using heat pressing) 1. Automatic exchange function for chip pickup tools 2. Multi-chip mounting is possible due to the above function ■ Process Management 1. Process analysis logs can be exported 2. Easy recipe standard included *For more details, please refer to the PDF document or feel free to contact us.
Price information
It may vary depending on the optional features, so please feel free to contact us.
Price range
P7
Delivery Time
OTHER
Please feel free to contact us. (Negotiable)
Model number/Brand name
Flip Chip Bonder CB-600
Applications/Examples of results
【Applications】 ■Compatible with various packages for MEMS, 5G, data communication, millimeter-wave sensors, photonics, and AR fields. ■Customized with a variety of options, primarily offered to overseas users focusing on R&D. *For more details, please refer to the PDF document or feel free to contact us.
Detailed information
Line up（3）
| Model number | overview |
|---|---|
| CB-200 | Desktop Flip Chip Bonder https://www.ipros.jp/product/detail/2000558584 |
| CB-505 | Manual Flip Chip Bonder https://www.ipros.jp/product/detail/2000558581 |
| CB-700 | Ultra High Precision Flip Chip Bonder |
catalog（3）
Download All Catalogs
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Distributors
We respond flexibly and promptly to customer needs. In the "trading company" functional area, we are fully committed to providing truly attractive products and services that meet customer needs by collaborating with leading specialized manufacturers and utilizing advanced mechatronics technology to add value, thereby adapting to a highly information-oriented society. In the "mechanical parking equipment" business, we manufacture and install high-quality, environmentally friendly, and safety-conscious products to meet various customer needs. Based on our accumulated wealth of experience and technology, we provide 24-hour maintenance services through a nationwide service network, earning strong trust from our customers. The "freeze-drying equipment" business consistently develops next-generation "freeze dryers," including the sealed tube-type freeze dryer, which received the Minister of Economy, Trade and Industry Award from the Japan Industrial Machinery Manufacturers Association. We deliver and maintain both small-scale research and large-scale production equipment, and we also support the development of pharmaceuticals and food, establishing ourselves as an industry leader and receiving high praise. ◆ Locations Sapporo, Hitachi, Nagoya, Osaka, Fukuoka, Yamaguchi ◆ Overseas Subsidiary Thailand - Business activities: Sales of resin molded products, metal processed products, sheet metal, packaging materials, and electronic components.