Mass production ultrasonic dicing equipment: Ultrasonic cutting device CSX501
Ultrasonic assisted spindle equipped with a dual-end support mechanism that enables high-speed, high-precision cutting, improving productivity and quality - Ultrasonic dicing device!!
The mass production ultrasonic dicing device "CSX501" is a dicing machine that cuts difficult materials such as SiC, GaN, and fine ceramics with high speed and precision. The ultrasonic-assisted cutting with "CSX501" adds ultrasonic assistance to the "force generated by the rotation of the blade," allowing the blade to "vibrate in the outward direction" while cutting. This technology enables the achievement of improved throughput, reduced running costs, and increased yield while maintaining high-quality cutting. Furthermore, the addition of device monitoring functions allows for remote support, contributing to a reduction in recovery time from unexpected troubles. Additionally, by equipping various optional functions, it also contributes to the control of blade edge shapes and the reduction of cutting burrs. *We also conduct evaluations by cutting sample work upon request, so please feel free to contact us. *For more details, please refer to the PDF materials.
basic information
【Specifications】 ■Compatible work sizes: 6, 8 inches (shared) ■Blade height: Maximum 12mm (cutting limit 10mm) ■Cleaning method: 2-fluid JET + high-pressure JET ■Conveying mechanism: In-house manufactured conveying mechanism ■Device specifications: Fully automatic ■Options: Inline dress, pre-cut function, blade twister ■Equipped with constant damage detection function ■Supports upper-level communication ■Dimensions: W1,200 × D1,300 × H1,850 mm *For more details, please refer to the PDF document or feel free to contact us.
Price information
The price varies depending on the desired accessories and options, so please contact us.
Price range
P7
Delivery Time
OTHER
Approximately 6 to 7 months with standard specifications.
Model number/Brand name
Mass production ultrasonic cutting device CSX501
Applications/Examples of results
【Applications】 - Various wafer dicing (6, 8 inch) - Special processing - Processing of difficult-to-cut materials such as SiC 【Achievements】 - Adopted by major domestic and international comprehensive electronics manufacturers, major electrical equipment manufacturers, and major electronic component manufacturers.
Line up（3）
| Model number | overview |
|---|---|
| Cross-sectional observation pre-treatment cutting device CSX-100Lab | |
| Single-sided wet processing equipment, batch-type cleaning equipment | |
| TWP series (TWPm, TWP) |
