Tabletop Flip Chip Bonder CB-200 Athlete FA Model
Space-saving semi-auto FC bonder compatible with 100[V] power supply.
The "CB-200" is suitable for small-scale and multi-variety production. Its highly versatile device concept accommodates various packages (※1) and various bonding processes (※2). ※1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. ※2 ACF, ACP, NCF, NCP, ultrasonic, etc.
basic information
■Response Process 1. Heat Pressing 2. Ultrasonic Welding ■Space-Saving Design Main Unit: 702W × 805D × 740H [mm] *Control box is separate ■Can set two 4-inch trays simultaneously *For more details, please refer to the PDF document or feel free to contact us.
Price information
It may vary depending on optional features, so please feel free to contact us.
Price range
P7
Delivery Time
OTHER
Please feel free to contact us. (Negotiable)
Model number/Brand name
Flip Chip Bonder CB-200
Applications/Examples of results
■Supports various packages for MEMS, 5G, data communication, millimeter-wave sensors, photonics, and AR fields. ■Customized with a variety of options and provided to users, including those overseas. *For more details, please refer to the PDF materials or feel free to contact us.
Line up（3）
| Model number | overview |
|---|---|
| CB-505 | Manual Flip Chip Bonder https://www.ipros.jp/product/detail/2000558581 |
| CB-600 | High Precision, Low Load Flip Chip Bonder https://www.ipros.jp/product/detail/2000554324 |
| CB-700 | Ultra High Precision Flip Chip Bonder |
