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Tabletop Flip Chip Bonder CB-200 Athlete FA Model

Space-saving semi-auto FC bonder compatible with 100[V] power supply.

The "CB-200" is suitable for small-scale and multi-variety production. Its highly versatile device concept accommodates various packages (※1) and various bonding processes (※2). ※1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. ※2 ACF, ACP, NCF, NCP, ultrasonic, etc.

basic information

■Response Process 1. Heat Pressing 2. Ultrasonic Welding ■Space-Saving Design Main Unit: 702W × 805D × 740H [mm] *Control box is separate ■Can set two 4-inch trays simultaneously *For more details, please refer to the PDF document or feel free to contact us.

Price information

It may vary depending on optional features, so please feel free to contact us.

Price range

P7

Delivery Time

OTHER

Please feel free to contact us. (Negotiable)

Model number/Brand name

Flip Chip Bonder CB-200

Applications/Examples of results

■Supports various packages for MEMS, 5G, data communication, millimeter-wave sensors, photonics, and AR fields. ■Customized with a variety of options and provided to users, including those overseas. *For more details, please refer to the PDF materials or feel free to contact us.

Line up(3)

Model number overview
CB-505 Manual Flip Chip Bonder https://www.ipros.jp/product/detail/2000558581
CB-600 High Precision, Low Load Flip Chip Bonder https://www.ipros.jp/product/detail/2000554324
CB-700 Ultra High Precision Flip Chip Bonder

Tabletop Flip Chip Bonder "CB-200" by Athlete FA

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Manual Flip Chip Bonder 'CB-505' by Athlete FA

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High-precision, low-load flip chip bonder CB-600 Athlete FA model

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Distributors

We respond flexibly and promptly to customer needs. In the "trading company" functional area, we are fully committed to providing truly attractive products and services that meet customer needs by collaborating with leading specialized manufacturers and utilizing advanced mechatronics technology to add value, thereby adapting to a highly information-oriented society. In the "mechanical parking equipment" business, we manufacture and install high-quality, environmentally friendly, and safety-conscious products to meet various customer needs. Based on our accumulated wealth of experience and technology, we provide 24-hour maintenance services through a nationwide service network, earning strong trust from our customers. The "freeze-drying equipment" business consistently develops next-generation "freeze dryers," including the sealed tube-type freeze dryer, which received the Minister of Economy, Trade and Industry Award from the Japan Industrial Machinery Manufacturers Association. We deliver and maintain both small-scale research and large-scale production equipment, and we also support the development of pharmaceuticals and food, establishing ourselves as an industry leader and receiving high praise. ◆ Locations Sapporo, Hitachi, Nagoya, Osaka, Fukuoka, Yamaguchi ◆ Overseas Subsidiary Thailand - Business activities: Sales of resin molded products, metal processed products, sheet metal, packaging materials, and electronic components.