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An inkjet equipment manufacturer boasting a wealth of delivery achievements in the semiconductor and electronic device fields, starting with the display sector. They offer a top-class lineup of equipment ranging from small devices for experiments and prototypes to large inkjet systems for mass production. All inkjet devices in the series can form thin films as well as thick films with 1-pass coating. The 'IP2030L' model, shown in the photo, enables high-resolution patterning and both partial and full coating. It is equipped with a uniquely developed liquid delivery system and discharge control technology, significantly improving ink usage efficiency. It is also a versatile machine that can be used in a wide range of fields, including compatibility with particle-containing inks. 【Features】 ■ Coating resolution: up to 2400 dpi (scanning) ■ Coating area: up to 300 x 300 mm ■ High-speed coating specification at up to 300 mm/second ■ Equipment size: 1200W x 1200D x 2025H mm (compact design) ■ Options available include print head expansion, UL LED curing unit, CAD conversion tools, and more. *For more details, please refer to the PDF document or feel free to contact us.

【Other Features】 - Any device in the series can form thin films as well as thick films with a single-pass application, and by applying multiple coatings, it can accommodate even thicker film formation. - The uniformity of the formed film is outstanding thanks to our unique inkjet technology. - Our uniquely developed liquid delivery system and discharge control technology significantly improve ink usage efficiency. - It can be used in a wide range of fields, supporting conductive inks, insulating inks, resist inks, UV inks, and particle-containing inks. - Automatically generates coating patterns from CAD data to perform pattern coating. - There are models capable of accurately targeting and applying coatings in recessed areas. - A wide range of devices is available, from mass production inkjet coating machines to small inkjet coating machines for experiments and prototypes, with options for demonstrations and coating tests. *For more details, please refer to the PDF materials or feel free to contact us.

IP2030L

【Applications】 <Semiconductor Packages, Electronic Devices> ■ Buffer Coat (Insulating Material) ■ Rewiring (RDL) Formation (Interlayer Insulating Material, Thick Film Resist) ■ Bump Formation (Thick Film Resist) ■ Temporary Bonding (Temporary Adhesive) ■ Die Attach (Adhesive) ■ Encapsulation (Sealing Material) ■ Thick Film Coating of Photosensitive Resist SU-8 ■ Top Coat <MEMS> ■ Three-Dimensional Shape Formation (Thick Film Resist) ■ Plating Treatment (Thick Film Resist) ■ Sealing of Hollow Structure Devices (Sealing Adhesive) <Next-Generation Displays> ■ Dropping onto Pixels (Quantum Dots) <Thin Film All-Solid Lithium Secondary Batteries (LiB)> ■ Active Material, Electrolyte (LCO, Polymer, LATP) <Liquid Crystal> ■ Alignment Film (Polyimide Agent) *For more details, please refer to the PDF document or feel free to contact us.