Industrial Inkjet Coating Device 'IP1212L'
A rich lineup is available! Demonstrations of inkjet coating equipment and a well-equipped coating test environment are provided.
The "IP1212L" is a fully-fledged compact inkjet coating device designed for mass production, capable of both full and partial coating. All devices in the series can form thin films as well as thick films with a single pass coating. By applying multiple coatings, it can accommodate even thicker film formation. It is a model that can be used in a wide range of fields, compatible with conductive inks, insulating inks, resist inks, UV inks, and more. 【Features】 - Usable with various resist inks, polyimide inks, UV inks, and other functional materials - Coating area up to 120×120mm - High-speed coating possible at up to 500mm/second - Options available for automatic nozzle cleaning and more - Device size: 1400W×1200D×2015H mm *For more details, please refer to the PDF materials or feel free to contact us.
basic information
【Other Features】 ■ Developed based on technologies cultivated in mass production processes in the LCD display and electronic device industries. ■ Our product, which can efficiently mass-produce orientation films for LCDs and functional films for electronic devices, is widely used in the field of printable electronics and boasts a wealth of implementation achievements. ■ The uniformity of the formed films is outstanding due to our unique inkjet technology. ■ The uniquely developed liquid delivery system and discharge control technology significantly improve ink usage efficiency. ■ Our proprietary automatic coating film unevenness correction technology achieves excellent film uniformity. *For more details, please refer to the PDF document or feel free to contact us.
Price range
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Model number/Brand name
IP1212L
Applications/Examples of results
【Applications】 <Semiconductor Packages, Electronic Devices> ■ Buffer Coat (Insulating Material) ■ Rewiring (RDL) Formation (Interlayer Insulating Material, Thick Film Resist) ■ Bump Formation (Thick Film Resist) ■ Temporary Bonding (Temporary Adhesive) ■ Die Attach (Adhesive) ■ Encapsulation (Sealing Material) ■ Thick Film Coating of Photosensitive Resist SU-8 ■ Top Coat <MEMS> ■ Three-Dimensional Shape Formation (Thick Film Resist) ■ Plating Treatment (Thick Film Resist) ■ Sealing of Hollow Structure Devices (Sealing Adhesive) <Next-Generation Displays> ■ Dropping onto Pixels (Quantum Dots) <Thin Film All-Solid Lithium Secondary Batteries (LiB)> ■ Active Material, Electrolyte (LCO, Polymer, LATP) <Liquid Crystal> ■ Alignment Film (Polyimide Agent) *For more details, please refer to the PDF materials or feel free to contact us.
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