CI Series Bare Chip Appearance Inspection Device for Power Modules
By conducting a complete visual inspection of the chips before implementation, we can reduce losses in subsequent processes and improve yield! Ideal for acceptance inspection and screening in module assembly!
The "CI Series" is a device that conducts visual quality inspections of individual bare chips stored in a chip tray, classifying them as good or defective. Detection examples include edge cracks, chipping, scratches, foreign matter adhesion, discoloration, etc. Using the standard multi-angle lighting, it is possible to set lighting conditions that capture various defect modes that appear on the product. This device is suitable for pre-shipment inspections by semiconductor bare chip manufacturers and contract manufacturers. Examples of target products include power devices, ICs, image sensors, and wafer chips for various sensors. <CI8000> - Six-sided inspection model (inspection of all six sides: front, back, and sides) - Fastest processing capability of 8000 CPH - Equipped with a stage that enables high-resolution inspections <CI200i> - Front and back inspection model - Space-saving by conducting surface inspection in the tray - Minimizes contact with the product, ensuring no damage - Equipped with a high-resolution inspection stage *For more details, please refer to the PDF document or feel free to contact us.
basic information
<Features> ■ Adjustable to various defects with multi-angle lighting ■ Compact and space-saving design with all operations from the front ■ Minimizes contact with bare chips during in-tray inspection ■ Over-detection reduction tool through high-dimensional statistical analysis of image information (optional) <Model Lineup> ■ CI200i: Surface + backside inspection model ■ CI100i: Surface inspection model
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
