X-ray Automatic Inspection System XS Series, manufactured by Nordson
A high-resolution (<1μm) X-ray automatic inspection system designed for micro samples, such as wire bonding and micro bump bonding.
The XS series is a compact, high-resolution automatic X-ray inspection system designed for high-performance and high-speed inspection of semiconductor samples, wire bonding, single/multi-panel PCB assemblies, and samples on trays. It is capable of inspecting applications ranging from component-level inspections to medium-sized SMT boards.
basic information
【Features】 - High-speed AXI system with the smallest installation space for inline setup - Equipped with a micro-focus X-ray generator (sealed type / maintenance-free) - Minimum resolution <1μm - Multi-control motion system with linear drive - Digital CMOS flat panel detector - Automatic grayscale & magnification calibration function - Compatible with MES and SECS/GEM interfaces for traceability management of all products Additional Options - Configuration allowing loading/unloading from one side - Barcode scanner for recording serial numbers and product type sorting - Automatic barcode reader scan station (x-y gantry structure) - Radiation dose reduction filter Models XS2.5 Transmission (2D) + SFT + Off-axis (2.5D) XS3 Transmission (2D) + SFT + Off-axis (2.5D) + 3D
Price range
Delivery Time
Model number/Brand name
Nordson AXI XS Series
Applications/Examples of results
【Usage】 - Semi Backend Setup: Inspection of semiconductor wire bonding, optical devices & complex PCBs, and flexible substrates. - SMT Setup: Inspection of components and solder joints in PCB, hybrid, and chip-level assembly processes.
