Are you able to use "truly suitable parts" in semiconductor manufacturing equipment for the backend process?
Examples of solving issues in semiconductor manufacturing equipment, such as "chip scratches and cracks" and "chip carry-back problems during work," with "suitable parts" are presented.
【Exhibition Information】
◆ New Manufacturing and New Services Exhibition for Small and Medium Enterprises
Date: December 14, 2022 - December 16, 2022
Venue: Tokyo Big Sight, East Hall 7
Exhibition Zone: Machinery and Parts
Booth Number: D50
◆ 37th Nepcon Japan - Electronics Development and Implementation Exhibition
Date: January 25, 2023 - January 27, 2023
Venue: Tokyo Big Sight
Booth Number: 26-36
【What We Can Do】
The specifications of consumable parts vary due to the conditions and environments shown below.
■ Products eligible for pickup
■ Regarding chip shapes (external dimensions, thickness, other features, bumps, etc.)
■ Machines that will introduce our collets (manufacturer and model number, etc.)
■ Error detection methods (vacuum detection, optical detection, etc.)
■ Usage environment, such as temperature (consideration of heat resistance, etc.)
■ Applications and usage processes of our products (die attach, transfer to trays or packages, etc.)
■ Currently used collets (material, manufacturer, size, model number, etc.)
■ Background leading to the consideration of our products this time
*For more details, please refer to the PDF materials or feel free to contact us.
