Three-Star Belt Electronic Materials Division Product Catalog
Introducing a rich lineup from sintered molded paste to silver/silver nanoparticle application products and press auxiliary materials!
This catalog introduces the product lineup of the Electronic Materials Division of Mitsuboshi Belt Co., Ltd. It features a variety of sintered pastes, including conductor pastes (Ag-based/Cu-based) and CuNi resistance pastes, as well as thick film solutions such as laminated copper printed circuit boards (TPC) and via filling solutions. Each product is clearly summarized with its features, reliability data, specifications, and substrate composition. We encourage you to download and take a look. [Contents] ■ Sintered pastes ■ Thick film solutions ■ Via filling solutions ■ Silver/silver nanoparticle application products (pastes, inks, slurries) ■ Decorative paints and inks ■ Press auxiliary materials *For more details, please download the PDF or feel free to contact us.
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