We will be exhibiting at OPIE 26' held at Pacifico Yokohama from April 22 to 24. Our booth will be L-37 (Light and Imaging Sensor & Imaging EXPO). We plan to showcase the 3D line sensor CLS2, a single-point thickness sensor, a distance sensor, and Enovasense, which can measure the thickness of opaque objects.

We will be exhibiting at Nepcon Japan 2026, which will be held at Tokyo Big Sight from January 21 (Wed) to January 23 (Fri), 2026. If you are interested, please come to the venue. ■ Products to be exhibited 1. Spectral interference optical thickness sensor CHRocodile 2 DW/ 2IT 2. Chromatic aberration confocal optical line sensor CLS2 3. Non-contact thickness measurement sensor for opaque materials Enovasnese

We will be exhibiting at Semicon Japan 2024, which will be held at Tokyo Big Sight from December 11 (Wednesday) to December 12 (Friday). If you are interested, please come to the venue. ■ Products to be exhibited 1. Spectral interference optical thickness sensor CHRocodile 2 DW/ 2IT 2. Area scanner for measuring the thickness and shape of 12" wafers - Flying Spot Scanner (FSS) 3. Chromatic aberration confocal optical line sensor CLS2.0 4. Chromatic aberration confocal line camera CVC 5. Chromatic aberration confocal optical single-point sensor CHRocodile Mini 6. Non-contact thickness measurement sensor for opaque materials Enovasnese 7. Sensor for detecting internal defects non-contactly - Field sensor

We will be exhibiting at the Kyushu Semiconductor Industry Exhibition held at Marine Messe Fukuoka on September 25 (Wednesday) and September 26 (Thursday), 2024. If you are interested, please come to the venue. ■ Products to be exhibited - Spectral interference optical thickness sensor CHRocodile 2 DW/2IT - Chromatic aberration confocal optical line sensor CLS2.0 - Chromatic aberration confocal optical single-point sensor CHRocodile 2S, C, Mini *This time, there will be no actual display of the FSS for 12" wafer thickness mapping measurement, but if you need an explanation or would like to request a demo, please come to our booth.

We will be exhibiting at the Photonix Osaka exhibition held at Intex Osaka from May 14 (Wednesday) to May 16 (Friday), 2025. If you are interested, please come to the venue. ■ Products to be exhibited - Laser photo-thermal sensor from Enovasense - Chromatic aberration confocal 3D line sensor - ProCutter Prime variable laser spot diameter high-power laser cutting head - LWM laser welding monitoring device - CoaxPrinter coaxial wire head for metal 3D printer (complete package: with wire feeding, pyrometer, IDM) - ScanMaster high-speed shape recognition, parameter optimization, OCT, scanner welding - ScanWelder/WM new camera 1-axis oscillating head for seam tracking, high-speed image processing & shape recognition

We will be exhibiting at the Photonix Tokyo exhibition held at Makuhari Messe from October 29 (Tuesday) to October 31 (Thursday), 2024. If you are interested, please come to the venue. ■ Products to be exhibited Laser photothermal sensor by Enovasense ProCutter 2.0 60kW cutting head WeldMaster YW52 CANUNDA-HP LWM

We will be exhibiting at NEPCON Japan, held at Tokyo Big Sight from January 22 to 24, 2025. If you are interested, please feel free to visit our booth. ■ Products to be exhibited - Spectral interference thickness sensor CHRocodile 2IT - Area scanner FSS80 - Chromatic aberration confocal sensor CHRocodile Mini - Chromatic aberration confocal line sensor CLS2 - Chromatic aberration confocal line camera CVC - Thickness measurement sensor for opaque materials Enovasense - Area sensor for internal defect inspection Field sensor

In October, at Photonix 2023 held at Makuhari Messe, our Laser Equipment Division Manager, Tanaka, will give a lecture on "The Latest Monitoring Technologies in the e-Mobility Process." He plans to cover important topics such as film thickness measurement in calendaring, which is crucial in the manufacturing process of lithium-ion batteries, and examples of laser welding quality at electrode contacts. If you are interested, please be sure to attend.