プレシテック・ジャパン Official site

For high-precision thickness measurement of opaque materials, Enovasense's laser photo-thermal sensor can measure thickness from a minimum of 10nm, regardless of the material.

■Thickness measurement range 10nm~1mm ■Measurement accuracy 0.5~3% or less ■Beam spot diameter φ0.15mm or more ■Measurement mode Phase shift, amplitude ■Product lineup Multiple lineups available for probes (working distance, beam spot diameter) and lasers (wavelength, power)

In addition to the conventional chromatic aberration confocal method and spectral interference method, a thickness measurement sensor utilizing laser heating has also emerged. It can measure the thickness of both transparent and opaque materials non-contactly.

**Principle** Our products mainly have three types of measurement principles. ■ Chromatic Aberration Confocal Primarily used for measuring surface shapes, but can also be utilized for measuring the thickness of transparent materials. While it is less accurate than spectral interference methods, it is recommended if you are looking for a cost-effective thickness measurement. ■ Spectral Interference Method Mainly used for thickness measurement. It enables high-precision measurements at the sub-micron level, leveraging the strengths of the spectral interference method. High-speed measurements necessary for in-situ, monitoring, or inline applications are possible. ■ Method Utilizing Laser Heating (Sensors from Enovasense) Heats the target object with a laser diode. It takes advantage of the fact that the speed of heat propagation differs depending on thickness. Using a proprietary algorithm, it detects the radiant heat from the target object and converts it into thickness. **Product Lineup** - Single Point Sensors Available in high-precision types as well as more affordable options under 1 million yen. - Line Sensors Using chromatic aberration confocal technology, it can perform full-area measurements in conjunction with an operating stage. - Area Scanner Sensors A type that can perform area scans with a two-axis galvanometer. There are also area scanners that do not require an operating stage and are unaffected by vibrations.

Non-contact line sensor CLS. High precision, high speed, and wide range 3D shape measurement. High tolerance for angles suitable for edges and slopes. Numerous achievements in wafer edge measurement.

【Application】 Non-contact 3D shape measurement is possible. It is also possible to replace contact methods with non-contact methods. ■ Home Appliances (Smartphones) - LCD glass - OLED mask inspection - Fine scratches and other surface defects - Wire bonding - AR glasses ■ Semiconductor Manufacturing Process - Wafer edge shape measurement - Wafer edge defect inspection - Wafer dicing groove appearance inspection - BGA inspection - IC package and circuit inspection ■ Automotive - Valve inspection - Car interior - Glass inspection - Inspection of airbag welding beads