We will be exhibiting at the Electronics Total Solution Exhibition / JPCA Show held at Tokyo Big Sight for three days from June 1 (Wednesday). At the Rishou Industrial booth, we will showcase materials for printed circuit boards with excellent thermal conductivity for mounting heat-generating components such as high-brightness LEDs and power semiconductors, as well as adhesive sheets and electrostatic discharge (ESD) laminate boards that are useful in environments such as electronic component factories where ESD measures are necessary. Our booth location is "East Hall 2 / 2E-02." We look forward to welcoming many visitors.

Recently, Rishou Industrial has registered the trademark "RISHOCAST" as a unified brand for products based on Rishou Industrial's casting technology, including transformers, instrument transformers, high-voltage power factor correction capacitors, resin insulators, and resin bushings. For over 60 years, we have been committed to the molding of electrical equipment. Rishou Industrial successfully achieved the molding of instrument transformers for the first time in Japan in 1953. Since then, we have actively pursued the molding of electrical equipment, and in 1973, we became the first in Japan to successfully mold distribution transformers. Furthermore, in 1985, we achieved the world's first successful molding of high-voltage power factor correction capacitors. In 2008, we also succeeded in molding pulse transformers that supply pulse power to high-power microwave tubes (klystrons). In this way, Rishou Industrial has been involved in the development and manufacturing of explosion-proof and disaster-resistant electrical equipment that does not use oil for insulation for over 60 years. Moving forward, we kindly ask for your continued support along with the "RISHOCAST" brand.

Recently, Rishou Industrial has developed a printed wiring board material (CS-3305) for semiconductor packages that minimizes warping during reflow soldering, even at a thin thickness. With a thickness of 0.06mm, it excels in rigidity at high temperatures and also has excellent laser processing capabilities, contributing to a reduction in mounting defects and improved processing yield. As electronic devices become smaller and more high-performance, there is an increasing demand for further miniaturization and thinning of semiconductor packages. We expect CS-3305 to be adopted as a substrate material that can meet these demands. 【Features】 ○ Does not warp due to soldering heat. → CS-3305 is expected to have minimal warping during the reflow process even at high temperatures of 250°C, reducing the likelihood of connection failures. ○ No swelling or peeling due to soldering heat. → CS-3305 is a high heat-resistant material that can withstand temperatures above 300°C, while maintaining a low free volume and a molecular structure that is difficult to absorb moisture, contributing to a reduction in defects during reflow. ○ Good laser processing. → CS-3305 has a composition of the insulating layer (resin and glass cloth) that is nearly uniform, making it a substrate material with good laser processing capabilities, which also contributes to improved yield in drilling processes.

At the Shiga factory of Richa Industrial, we accept express fees and have established a system to manufacture multilayer copper-clad laminates ranging from 4 layers to 8 layers, from receiving the film data for the inner layer circuits to shipping, in as little as 12 hours. This system, named QRS (Quick Response System), has been in operation for 10 years, and we have further enhanced it to meet demands. We have compiled the details in the attached document and would like to invite you to read it.