Reducing warpage in the soldering process! Development of printed circuit board materials for thin package substrates.
利昌工業
Recently, Rishou Industrial has developed a printed wiring board material (CS-3305) for semiconductor packages that minimizes warping during reflow soldering, even at a thin thickness. With a thickness of 0.06mm, it excels in rigidity at high temperatures and also has excellent laser processing capabilities, contributing to a reduction in mounting defects and improved processing yield. As electronic devices become smaller and more high-performance, there is an increasing demand for further miniaturization and thinning of semiconductor packages. We expect CS-3305 to be adopted as a substrate material that can meet these demands. 【Features】 ○ Does not warp due to soldering heat. → CS-3305 is expected to have minimal warping during the reflow process even at high temperatures of 250°C, reducing the likelihood of connection failures. ○ No swelling or peeling due to soldering heat. → CS-3305 is a high heat-resistant material that can withstand temperatures above 300°C, while maintaining a low free volume and a molecular structure that is difficult to absorb moisture, contributing to a reduction in defects during reflow. ○ Good laser processing. → CS-3305 has a composition of the insulating layer (resin and glass cloth) that is nearly uniform, making it a substrate material with good laser processing capabilities, which also contributes to improved yield in drilling processes.
