Risho high thermal conductivity electronics materials
We support heat dissipation design with a diverse lineup.
Excellent thermal conductivity
basic information
High thermal conductivity copper-clad laminate Aluminum base substrate material High thermal conductivity adhesive sheet Resin-coated copper foil (RCC: Resin Coated Copper)
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Delivery Time
Applications/Examples of results
It is a high thermal conductivity material for manufacturing circuit boards equipped with high-brightness LEDs and power semiconductors.
Line up（5）
| Model number | overview |
|---|---|
| CS-3945 | High thermal conductivity printed circuit board material, thermal conductivity = 1.3W/mK |
| CS-3295 | High thermal conductivity printed circuit board material, thermal conductivity = 3.0W/mK |
| AC-7900 | Aluminum base substrate material, thermal conductivity = 1.0W/mK |
| AC-7200TX/TY | Aluminum base substrate material, thermal conductivity = 2.5W/mK / 5.0W/mK |
| AD-7200TX/TY | High thermal conductivity adhesive sheet, thermal conductivity = 2.5W/mK / 5.0W/mK |
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The fundamental technologies of our company are Laminating Technology and Casting Technology. We are deeply exploring these two technologies and advancing diversification. In the case of general-purpose products, we continue our self-help efforts, such as pursuing thorough rationalization to become a last-one company.