10 times the thermal conductivity! High thermal conductivity printed circuit board materials.
Achieves 10 times the thermal conductivity compared to conventional printed circuit board materials!
The heat emitted by high-brightness LEDs and power devices destabilizes their operation and accelerates the degradation of surrounding materials such as substrates and encapsulating resins. Therefore, substrate materials are required to efficiently transfer heat to the casing and heat sinks. High thermal conductivity printed circuit board materials support the heat dissipation design of substrates equipped with high-brightness LEDs and power semiconductors, with a thermal conductivity that is ten times greater than that of standard printed circuit board materials (FR-4). ------------------------------【Features】--------------------------------- ■ Achieves a thermal conductivity of 3.0 W/mK with glass cloth ■ Can be made thin, thus supporting thermal management from the aspect of "reducing thermal resistance" ---------------------------------------------------------------------------
basic information
This is a copper-clad laminated board made of glass cloth epoxy resin that achieves a thermal conductivity of 3.0 W/mK. Tests based on the Japan Printed Circuit Association (JPCA) standard "Test Methods for Electronic Circuit Boards for High Brightness LEDs: JPCA-TMC-LED02T" have confirmed the effectiveness of reducing thermal resistance. -------------------------------------------------------------------------------------------------------- Rishou Industry offers printed wiring board materials that combine insulation reliability and high thermal conductivity. We have materials such as aluminum base substrates, high thermal conductivity printed wiring board materials (CCL), and high thermal conductivity adhesive sheets, so please take a look at the details. --------------------------------------------------------------------------------------------------------
Price range
Delivery Time
Model number/Brand name
CS-3295
Applications/Examples of results
LED substrates, power semiconductor substrates, and substrates equipped with heat-generating components that require thermal management.
Line up（1）
| Model number | overview |
|---|---|
| CS-3295 |
