High thermal conductivity prepreg
The variations for heat dissipation measures will expand.
It is an adhesive thermal conductive material with high thermal conductivity and insulation reliability.
basic information
We can manufacture heat dissipation substrates with a multilayer structure, allowing for the establishment of new thermal conduction pathways and increasing the flexibility of thermal management.
Price range
Delivery Time
Model number/Brand name
ES-3245
Applications/Examples of results
A structural material that connects a substrate equipped with heat-generating components such as high-brightness LEDs and power semiconductors to a heat dissipation plate (heat sink).
Line up（1）
| Model number | overview |
|---|---|
| E-3245 | Thermal conductivity = 3.0 W/mK |
