Thermosetting resin adhesive sheet for printed circuit board manufacturing
A lineup tailored to specific uses.
This product consists of a thermosetting resin blended according to its intended use, stretched to approximately 120 micrometers, and provided sandwiched between release films. This material is intended for printed circuit board manufacturers and is not something that can be adhered at room temperature and atmospheric pressure like commercially available double-sided tape. The resin is delivered in a semi-cured (B-stage) state. Depending on the season, thermal curing may begin due to outdoor or room temperatures, so we may deliver it using a so-called "cool delivery" service after consulting with the customer.
basic information
We have received much support by offering a diverse lineup tailored to various applications as follows: - Type with minimal overflow - Type that does not transmit light - Type with 17 times higher thermal conductivity - Type that combines 30 times thermal conductivity with 300℃ heat resistance - Type suitable for preventing solder cracks
Price range
Delivery Time
Model number/Brand name
Rishoraito
Applications/Examples of results
Manufacturing of laminated substrates, cavity substrates, optical sensor substrates, high-brightness LED substrates, power semiconductor substrates, etc.
Detailed information
-
AD-7006W (left) and AD-7006. This is a type with minimal resin overflow.
-
AD-7006B. It is a type that does not transmit light.
-
AD-7210N (left) and AD-7200TY. They are high thermal conductivity types.
-
AD-7303 is suitable for preventing solder cracks.
-
Press conditions. For example, equipment is required that can press at a pressure of 4 megapascals for 240 minutes, while applying heat of 180°C for 180 of those minutes. Of course, the manufacturing technology and know-how related to this are also necessary.
-
Manufacturing of cavity substrates using AD-7006 / AD-7006W (Rough image / Proposal from Rishou Industry)
-
Light transmittance of AD-7006B (0.04mm thickness). It hardly transmits light in the range from ultraviolet to infrared.
-
Manufacturing of a heat dissipation substrate using AD-7210N (Proposal from Rishou Industry as an alternative to ceramic substrates)
-
AD-7303 remains very soft even after curing, absorbing dimensional changes in the aluminum plate to suppress the occurrence of solder cracks.
Line up（6）
| Model number | overview |
|---|---|
| AD-7006W (White Type) | This is a type with minimal resin overflow (spillage in unwanted areas) during the connection process. It is suitable for the production of substrates that require fine processing. |
| AD-7006 (Clear Type) | It has the same performance as the AD-7006W, but the appearance is a transparent type. |
| AD-7006B (black type) | It has the same performance as AD-7006, but the appearance is black. Even with a thickness of 0.04mm, it hardly transmits light in the visible spectrum as well as in the near-infrared wavelength range. It is suitable for optical sensor substrates. |
| AD-7200TY (High Thermal Conductivity Type) | The thermal conductivity of the insulating resin used in general printed circuit boards is about 0.3 W/mK. In contrast, AD-7200TY has a thermal conductivity of 5 W/mK, which is 17 times higher (based on JIS R1611). The measured thermal conductivity based on ASTM D5470 is 6 W/mK. It also excels in long-term reliability. |
| AD-7210N (High thermal conductivity & high heat resistance type) | It combines thermal conductivity of 10W/mK (JIS R1611) and heat resistance (Tg) of 300℃. By incorporating AD-7210N as an insulating layer, we propose that even general printed circuit board manufacturers can produce substrates with thermal dissipation comparable to that of expensive ceramic substrates. The measured thermal conductivity based on ASTM D5470 is 8W/mK. |
| AD-7303 (solder crack prevention) | It is a very soft (low elasticity) resin even after heat curing. It also has a thermal conductivity of 3W/mK (JIS R1611 / ASTM D5470). By using AD-7303 as the insulating layer for aluminum-based printed circuit boards, it absorbs the thermal expansion of the aluminum plate, thereby reducing the occurrence of solder cracks. |
