Ryozeiki Co., Ltd. will exhibit at the 24th Mold Processing Technology Exhibition. <INTERMOLD 2013 (24th Mold Processing Technology Exhibition) / Mold Exhibition 2013> Date: April 17 (Wednesday) - April 20 (Saturday), 2013 Time: 10:00 AM - 5:00 PM Venue: Tokyo Big Sight Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 Organizer: Japan Die & Mold Industry Association Management: Intermold Promotion Association Booth Number: 771 *When you visit, please be sure to stop by Booth Number: 771.

~We will assist with Japanese manufacturing!~ We are pleased to announce that Eiseiki Co., Ltd. will be exhibiting at "Mechatrotech Japan 2011 (abbreviated: MECT2011)." Our new wire-cut bridge allows for horizontal leveling of large workpieces and can reduce setup time. The precision grinding cylindrical device can process round pins and perform pin machining while rotating on a profile grinding machine. ■ Dates: September 29 (Thursday) to October 2 (Sunday) - 4 days ■ Venue: Port Messe Nagoya (Nagoya International Exhibition Center) Halls 1, 2, and 3 ■ Booth Number: 1D19 【Main Exhibited Products】 - Wire-cut Bridge (NEW) - Wire-cut Vise - Punch Index (with two-axis adjustment function) (NEW) - Precision Grinding Cylindrical Device (NEW) - Precision Vise We look forward to your visit. *For more details, please contact us directly.