Exhibition Information for the 15th Film Tech Japan (High-Performance Film Exhibition) - SANDO TECH Co., Ltd.

SANDO TECH, Inc.

Our company will be exhibiting at the "15th Film Tech Japan (High-Performance Film Exhibition)" during the High-Performance Materials Week scheduled to be held from October 29 (Tuesday) to 31 (Thursday).

Date and time Tuesday, Oct 29, 2024 ～ Thursday, Oct 31, 2024
10:00 AM ～ 06:00 PM
Only on the final day, it ends at 17:00.
Capital ■Venue: Makuhari Messe ■Address: 2-1 Nakase, Mihama Ward, Chiba City, Chiba 261-8550 ■Access: About a 5-minute walk from JR Keiyo Line "Kaihin Makuhari Station" About a 17-minute bus ride from JR Sobu Line / Keisei Line "Makuhari Hongo Station" ■Booth Number: 29-14 (inside Film Tech Japan) *On the left side after entering Hall 5
Entry fee Free

Related product information

[Test Accepting] Recycling-Compatible 'Ink Removal Cleaning Machine'
We will peel off and clean the coating layer, such as ink coated on the film! This was developed for film recycling and contributes to the SDGs!

【Test Equipment Specifications】 ■Transport Speed: Up to 20m/min ■Substrate: Various plastic films, metal foils, etc. ■Roll Diameter: Up to 400mm ■Substrate Width: Up to 300mm ■Roll Core: 3 inches or 6 inches We will select the cleaning agent according to the ink used, so if you wish to conduct a test, please first send us a film with ink (approximately 1 meter). For peeling other than ink, the selection of the cleaning solution will generally be the responsibility of the customer. Please feel free to contact us for more details.
[Test Reception Open] Information on film processing test machines
Introducing our testing equipment, including a price device that connects new and old substrates in as little as 1 second, and a cleaning machine that does not damage the base material!

【In-house Testing Equipment】 ■Clean Room (Class 10,000, Cleaning Machine Line Only Class 1,000) ■Splice, Coating, and Drying Line <Common Testing Conditions> Substrate: Film, Foil, Paper, etc. Substrate Width: 250–500mm Core: 3 inches, 6 inches Transport Speed: Up to 50 m/min <Splice Machine Testing Conditions> Substrate Thickness: 10μm and above Substrate Length: 10m or more (×2 pieces) <Coater Testing Conditions> Coating Method: Direct Gravure, Reverse Gravure, Impregnation, Die <Dryer Testing Conditions> Temperature: Up to 150℃ ■Film Cleaning Machine, Annealing Equipment Line <Common Testing Conditions> Substrate Width: Up to 500mm Core: 3 inches, 6 inches Tension: 50–200N Transport Speed: Up to 20 m/min <Annealing Equipment Testing Conditions> Temperature: Up to 150℃ In-Furnace Retention Length: 3.6m ■Film Ink Stripping and Cleaning Testing Machine Substrate Width: Up to 300mm Raw Material Diameter: Up to 400mm Core: 3 inches, 6 inches Transport Speed: Up to 20 m/min *Please note that we do not accept contract (mass production) processing.