Wafer special die-cut processing
Silicon wafer dicing processing is being performed.
Mainly, we perform drilling processing for wafer inch-down.
basic information
Makino Milling Machine Co., Ltd. Machining Center
Price range
Delivery Time
Applications/Examples of results
We are happy to assist you. Please feel free to contact us.
catalog（2）
Download All Catalogs
Recommended products
Distributors
Our company specializes in precision processing of silicon, ceramics, quartz, alumina, glass, silicon wafers, and semiconductor compounds using advanced technology and know-how. Additionally, through the manufacturing and sales of wrapping materials and auxiliary materials, we significantly contribute to the development of the electronics industry.