Processed sample

Processed sample
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Sanken-sha Fine Processing Ultra-thin Silicon Ring
We process with the latest equipment and the latest technology.
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Sanken-sha Wrapping Sample
We have achieved ultra-thin wrap.
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Wafer Zagrie Processing & Inch Down <Presentation of Processing Procedure Materials>
We can handle small lots starting from one piece with short delivery times. You can trust us with round and square shape machining, as well as wafer processing from 6 to 12 inches.
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Sanken-sha 3D Processing Sample
This is a three-dimensional processed product realized with our 5-axis machining center.
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Sanken-sha Co., Ltd. Company Profile
Faithfully reproducing the products that customers want to create. Responding to the diverse needs of the electronics industry.
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Silicone ultra-fine processed products (minimum 0.5φ)
Semiconductor parts microfabrication. We accept processing from 1 to 100 pieces per month.
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Wafer special die-cut processing
Silicon wafer dicing processing is being performed.
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Silicon grinding bridge, mortar processing
We specialize in taper processing during silicon machining.
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Silicone combination product three-dimensional processing
We create two types of silicone combination parts and make them movable during the process within the device.
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Silicon side sputtering target
This processing requires a significant amount of positioning. We maintain a guarantee of ±0.05.
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Silicone set jig
We have created a silicon wafer jig with the same expansion coefficient as the silicon wafer.
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Silicone thin ring
We also process ultra-thin silicone rings with high precision.
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Silicon crucible tester
We respond to short delivery times from a single crucible. We also accept processing of sintered materials such as silicone, ceramics, glass, and quartz.
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